Evaluation of various implementation substrates

IPC-A-610 certified IPC specialists are available! Assistance with observations in accordance with international standards.

At AITES Co., Ltd., we provide a wide range of technical services for evaluation tests of printed circuit boards (mounted boards) equipped with electronic components. We conduct reliability tests, solder joint observations, whisker observations, and cross-sectional observations. We assist with observations in accordance with international standards, offer consultations, and address various concerns regarding observations. Additionally, we offer services such as X-ray observations, appearance inspections, and shape measurements, so please feel free to contact us when needed. 【Service Contents】 ■ Reliability Testing ■ Solder Joint Observation ■ Whisker Observation ■ Cross-Sectional Observation *For more details, please download the PDF or feel free to contact us.

• Other analysis and evaluation services

We provide quick and accurate solutions based on technology and experience for quality initiatives that consider performance, reliability, disposal, and recycling from the product planning stage.

● Comprehensive technical services covering the entire product life cycle We provide support throughout the entire product life cycle, including raw material evaluation during development necessary for improving the quality of electronic components, reliability testing and result analysis, timely feedback of failure analysis and results to the development and manufacturing sites after shipment, and consulting for quality problem resolution. ● Prompt analysis and reporting of reliability test results For defects identified in reliability testing, we assist in accurate and timely cause identification and analysis through a rich and efficient analysis menu. ● Use only the services you need, as much as you need You can freely choose from a range of services, including conducting tests and inspections based on a predetermined evaluation plan, developing evaluation and analysis plans for problem resolution, result analysis, cause investigation, and consultation, according to your needs.

• Analytical Equipment and Devices
• Contract Analysis
• Contract Inspection

By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, it is important to observe not only the shape but also the metal structure.

• Contract Analysis
• Contract measurement
• Other contract services

We conduct reliability evaluation tests for various electronics products, components, and materials in accordance with standard specifications such as JIS, JEDEC, and MIL.

■High Accelerated Life Test: 5 units ■Thermal Shock Test: 24 units ■Constant Temperature and Humidity Test: 22 units ■Liquid Tank Thermal Shock Test: 3 units ■High Temperature Storage Test ■Hot Oil Resistance Evaluation Test ■Insulation Resistance Continuous Monitoring Evaluation ■Continuity Resistance Continuous Monitoring Evaluation ■Electromigration Continuous Monitoring Evaluation ■Microfocus X-ray Transmission Observation ■Ultrasonic Microscope Observation ■ESD Evaluation Test ■CDM Evaluation Test ■Universal Tensile Evaluation Test ■Cross-section (Polishing) Observation Service (Evaluation before and after environmental testing is also possible) ■Solar Cell (Crystalline Silicon/Amorphous Silicon/Compound/Organic Thin Film, etc.) EL Emission Phenomenon ■Heat Generation Observation

• Testing Equipment and Devices
• Other inspection equipment and devices
• Contract Inspection

We conduct environmental testing, as well as non-destructive observation and electrical property measurements.

At AITES, we use environmental testing equipment that conforms to standard specifications such as JIS, JEDEC, and MIL, and we accept commissioned testing for reliability evaluation of various electronics products, components, and materials. We offer a range of tests including electrical testing, non-destructive observation, and power cycle testing. 【Environmental Testing】 ■ Highly Accelerated Life Testing ■ Constant Temperature and Humidity Testing ■ Thermal Shock Testing ■ Liquid Bath Thermal Shock Testing ■ Temperature and Humidity Cycle Testing ■ In-Situ Continuous Measurement Reliability Evaluation Testing Service *For more details, please refer to the PDF materials or feel free to contact us.

• Analytical Equipment and Devices
• Analysis Services

Each part is carefully polished by hand, using an efficient process without waste!

Our company specializes in "cross-section polishing of implemented components and electronic parts." To quickly provide suitable cross-section samples for the observation of various components, we carefully polish each part by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly providing suitable cross-section samples for the observation of various components ■ Carefully polishing each part by hand, using an efficient process without waste *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Surface treatment contract service
• Other contract services

You can closely observe the solder joint condition of electronic components on the implementation board and the internal structure of the components!

Our company conducts "cross-sectional observation of surface-mounted electronic components." Through cross-sectional observation after mechanical polishing, it is possible to closely examine the solder joint condition (presence of cracks and voids) of electronic components on the mounted substrate, as well as the internal structure of the components. For "SOP components," detailed observation can be made from the overall cross-section to the solder connection, while for "aluminum electrolytic capacitors," it is possible to observe the internal structure of the electrolytic capacitor components and their connection to the substrate. 【Features】 ■ SOP (Small Outline Package) components - Detailed observation can be made from the overall cross-section of SOP components to the solder connection. ■ Chip ceramic capacitors - Detailed observation can be made from cracks in the component material to cracks in the solder area. ■ Aluminum electrolytic capacitors - Observation can be made from the internal structure of the electrolytic capacitor components to their connection to the substrate. *For more details, please refer to the PDF document or feel free to contact us.

• Contract Inspection
• Other contract services

The inspector observes without missing anything! Consistent whisker evaluation is possible from reliability testing to analysis.

While lead-free solder is becoming widespread, whiskers formed from Sn plating or solder joints have a significant impact on the reliability of electronic components. Our company offers a consistent whisker evaluation process from reliability testing to analysis. Inspectors carefully observe which components and pins on the substrate have whiskers. 【Features】 ■ Conduct visual inspections of assembled boards after reliability testing to determine the presence of whiskers. ■ If whiskers are detected during visual inspection, observe and measure them using a digital microscope. ■ For more detailed observation and analysis, perform surface SEM/EDX analysis. ■ If necessary, observations and analyses such as cross-sectional observation (SEM) and crystal orientation analysis (EBSD) are also possible. *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Analysis Services

Support from reliability testing observations to 3D measurement! It is possible to conduct whisker evaluations while eliminating transportation risks.

While lead-free solder is becoming widespread, whiskers formed from Sn plating or solder joints have a significant impact on the reliability of electronic components. Our company observes whiskers using a digital microscope with depth composition capabilities and conducts three-dimensional measurements to evaluate whisker growth. By collaborating with the reliability testing group, we can implement whisker evaluations quickly and eliminate transportation risks. 【Features】 ■ Support from observation to three-dimensional measurement in reliability testing ■ Observation of whiskers using a digital microscope with depth composition capabilities ■ Ability to conduct whisker evaluations quickly and eliminate transportation risks *For more details, please refer to the PDF document or feel free to contact us.

• Analysis Services
• Other contract services

Introducing a test that allows for the observation of fracture and delamination layers by permeating coloring liquids and fluorescent liquids!

We would like to introduce our "Dye and Pry Test for Embedded Components." For confirming the breakage and delamination of packages and embedded components, there are non-destructive testing methods (such as transmission X-ray and CT) and cross-sectional observation. However, these methods make it difficult to capture the spread of delamination in the "plane" of the broken layers. In the Dye and Pry Test, by permeating a colored or fluorescent liquid, we can observe the broken and delaminated layers. Please feel free to contact us if you have any inquiries. 【Flow of the Dye and Pry Test】 ■ Dye immersion ■ Pry ■ Observation using optical microscopy or SEM *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Contract measurement
• Contract Inspection

Calculating the crack rate of ball joints and implementing it according to customer specifications!

After the solder durability test on the circuit board, if cracks occur in the solder joints, the crack rate will be calculated to confirm whether the cracks are within the allowable standards. The evaluation standards after the solder durability test can be individually defined based on the product environmental specifications, so most customers have their own standards. The measurement methods vary according to the shape of the components, but when you make a request, we will carry out the tests according to your specifications. 【Service Contents】 ■ Solder joints of BGA - Calculation of crack rate for ball joints ■ Solder joints of chip resistors - Calculation of crack rate for both ends of square and rectangular terminals ■ Solder joints of coil components - Calculation of crack rate for ribbon leads and QFP leads *For more details, please refer to the PDF document or feel free to contact us.

• Contract measurement

Not only the joints of electronic components, but also the evaluation of fixed parts such as screws!

At AITES Co., Ltd., we conduct "Thermal Shock Testing." By repeatedly exposing samples to high and low temperatures, not only does stress occur due to thermal effects, but also due to the expansion and contraction of various parts. Repeated stress also adds to the overall stress. This test is conducted not only for the joints of electronic components but also for evaluating fixed points such as screws. 【Main Specifications of the Thermal Shock Testing Equipment】 ■ Internal dimensions: W650×H460×D370mm, Temperature range: -65 to 0/+60 to 200℃ ■ Internal dimensions: W650×H460×D670mm, Temperature range: -65 to 0/+60 to 200℃ ■ Internal dimensions: W970×H460×D670mm, Temperature range: -65 to 0/+60 to 200℃ *For more details, please refer to the PDF document or feel free to contact us.

• Testing Equipment and Devices

Supports high temperatures up to 180℃! Effective for testing and evaluating automotive and high-temperature electronic components and other heat-resistant parts.

At AITES Co., Ltd., we conduct "Liquid Tank Thermal Shock Testing." This testing method applies stress due to temperature changes using a liquid medium, and because the temperature changes are more abrupt than those in chamber-type thermal shock tests, it is an effective method for conducting tests in a short period. Our equipment can accommodate a maximum high temperature of up to 180°C, making it suitable for accelerated testing of high-heat-resistant components and materials. 【Features】 ■ Capable of handling maximum temperatures up to 180°C ■ Effective for testing and evaluating high-heat-resistant components ■ More abrupt temperature changes than chamber-type thermal shock tests ■ Effective for conducting tests in a short period *For more details, please refer to the PDF materials or feel free to contact us.

• Testing Equipment and Devices

Observations before and after reliability testing and cross-sectional observations! Here are examples of observations of various implemented components.

We would like to introduce our service for "various cross-sectional observations of mounted components on circuit boards." Inside various electronic devices around us, there are circuit boards equipped with electronic components. When observing a mounted circuit board, you can see that numerous components are tightly soldered together, and it is necessary to confirm that the components are properly joined, as improper connections can prevent normal operation. Please contact us if you are considering observations before and after reliability testing or cross-sectional observations. 【Examples of Observations (Partial)】 ■ Ceramic Capacitors ■ Transistors ■ Chip Resistors ■ QFP ■ Connector Pins *For more details, please refer to the PDF materials or feel free to contact us.

• Analytical Equipment and Devices

Introducing the "Observation Mode" of a chip capacitor (MLCC) under a microscope!

We would like to introduce an example of cross-sectional observation of mounted components conducted by our company. Using commercially available computer circuit boards, we observed the solder joints of mounted components and the internal structures of the components with a metallurgical microscope. The observation modes of the metallurgical microscope include bright field observation, dark field observation, and polarized light observation, among others. Additionally, there are observations using transmitted light, and the observation mode is selected according to the sample. By conducting cross-sectional observations before and after reliability testing, we can evaluate the reliability of the product. When observing, it is important to select an appropriate "observation mode" to clearly capture the condition of the solder joint interface and defects such as cracks. [Case Overview] ■ Using commercially available computer circuit boards ■ Observing the solder joints of mounted components and the internal structures of the components with a metallurgical microscope ・Observation modes: bright field observation, dark field observation, polarized light observation, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

Features ● PICO-ITX standard ● Equipped with Intel Core Ultra 7 255U / Ultra 5 225U ● 16/32GB onboard memory ● 2.5GbE + 1GbE ● HDMI 1.4 + eDP 1.4 ● M.2 2280 M-Key x 1 (PCIe 4.0 [x4]/SATA) ● M.2 2230 E-Key x 1 (PCIe 4.0 [x1] + USB 2.0) ● USB 3.2 Gen 2 x 2 + USB 2.0 x 2 ● RS-232/422/485 x 2 ● TPM, GPIO 4-bit, SATA 6Gb/s x 1 ● SMBus/I2C (Default: SMBus) ● Intel AMT Support * This model does not include storage or OS.

Features: ● PICO-ITX standard ● Equipped with Intel Atom x7433RE/x7835RE ● DDR5 4800MHz×1 (up to 16GB) (sold separately) ● HDMI 1.4×1, eDP 1.4b/LVDS×1 ● 2.5GbE×1, GbE×1 ● Full-Size mSATA, M.2 2230 E-key x1 ● USB 3.2 Gen2[x1]×2, USB 2.0×4 ● RS-232/422/485×2, RS-232×2 ● TPM 2.0, SATA 6.0Gbps×1, GPIO 4-bit, SMBUS/I2C×1 * This is a model without an operating system.

Features: ● Equipped with Intel Processor N150 / Intel Core 3 Processor N355 ● DDR5 4800MHz SODIMM ×1 (supports up to 16GB) (sold separately) ● HDMI 1.4 ×1, eDP 1.4b / LVDS ×1 ● Intel Ethernet Controller I226 (2.5GbE RJ-45 ×1), Realtek RTL8111H (1GbE RJ-45 ×1) ● Full-size mSATA / mPCIe ×1, M.2 2230 E-Key ×1 ● USB 3.2 Gen2[x1] ×2, USB 2.0 ×4 ● RS-232/422/485 ×2, RS-232 ×2 ● TPM 2.0, SATA 6Gb/s ×1, 4-bit GPIO, SMBus / I2C ×1 ● Fan-equipped heat sink available separately PICO-ASL4-FAN01: Heat sink with fan PICO-ASL4-HSK01: Heat sink PICO-ASL4-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure) * This is a model without an operating system.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.