Introducing a test that allows for the observation of fracture and delamination layers by permeating coloring liquids and fluorescent liquids!
We would like to introduce our "Dye and Pry Test for Embedded Components." For confirming the breakage and delamination of packages and embedded components, there are non-destructive testing methods (such as transmission X-ray and CT) and cross-sectional observation. However, these methods make it difficult to capture the spread of delamination in the "plane" of the broken layers. In the Dye and Pry Test, by permeating a colored or fluorescent liquid, we can observe the broken and delaminated layers. Please feel free to contact us if you have any inquiries. 【Flow of the Dye and Pry Test】 ■ Dye immersion ■ Pry ■ Observation using optical microscopy or SEM *For more details, please refer to the PDF document or feel free to contact us.
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【Case Study】 ■BGA: Solder balls on the substrate side - As a result of observation, many solder balls fractured on the component side, progressing from the outer circumference of the ball. ■QFP: Solder joint on the substrate side - As a result of observation, the fracture progressed from the fillet heel of the lead joint. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.