Thermal shock test

At Aites Co., Ltd., we provide a wide range of technical services for evaluation tests of printed circuit boards (mounted boards) equipped with electronic components. We conduct reliability tests, solder joint observations, whisker observations, and cross-sectional observations. We have IPC-A-610 certified IPC specialists on staff who can assist with observations in accordance with international standards, consultations, and various observation-related concerns. Additionally, we offer services such as X-ray observations, appearance inspections, and shape measurements, so please feel free to consult with us when needed.

We would like to introduce the "strain measurement in thermal shock testing" conducted by our company. A sample with strain gauges attached was set up in the thermal shock testing device, and the wiring of the strain gauges was connected to an external data logger to record strain data in real time during the test. For two types of copper-clad laminates, the strain behavior during the thermal shock test was observed, and it was noted that significant strain occurred with changes in temperature. It was found that FR-1 exhibited greater strain compared to FR-4.