It is a semi-automatic lift-off device that is cheaper than an automatic machine and easier to use than a manual device.
This is a device that automatically transports, lifts off, and rinses just by setting the wafer (substrate). The lift-off process removes burrs with a high-pressure jet from the ASAP special nozzle and performs metal separation. Although it cannot be set with a cassette (carrier), unlike manual processes, it automatically transports each wafer, eliminating concerns about eccentricity or positional misalignment! With dry-in and dry-out processing, operators do not have to worry about chemical residue. The greatest advantage of lift-off is that thick metal can be blown away instantly with a high-pressure jet, making lift-off possible! Our biggest advantage is the combination of temperature-controlled stripping solution and high-pressure jet, which can also strip difficult-to-remove resist. Processes that involve brush cleaning or applying pressure for stripping can be easily replaced with high-pressure jets. [Features] - High-pressure jet lift-off up to 20 MPa - Removal of burrs during lift-off - No reattachment - Combination of temperature control and high-pressure jet - Recycling system for temperature-controlled chemicals (optional) Please feel free to try it out with a free demo!
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basic information
【Main Specifications】 ■ Wafer Size: Compatible with φ2" to φ8" ■ Expansion Function: Pipe heater or temperature control liquid via recycling ■ Chemicals Used: Various stripping solutions such as DMSO, NMP ■ Equipment Size: Example, 1300×1100×H1800 (main unit with 3 cups) ■ Fire Extinguisher System (optional) Many other options available! *For more details, please refer to the PDF document or feel free to contact us.
Price information
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Delivery Time
※4 to 5 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
VCSELs, LEDs, LDs, SAW filters, and MEMS are being adopted by various manufacturers.
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Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.