Achieving swelling and high-pressure jet lift-off with high temperature, high peeling force, and low chemical consumption through a recycling-type circulation heater with a sheet-type design comparable to DIP!
Complete removal of stubborn resist that has become difficult to remove with a combination of a leaf-type device for DIP-level swelling and ultra-high pressure jet! ● Stubborn resist can be removed with repeated processing of swelling and high-pressure jet! - Resist that has become difficult to remove after high-temperature baking - Resist after dry etching - Resist deep within fine patterns Additionally, there is no issue with burrs or metal reattachment that can occur with DIP processing! This ultra-high pressure jet lift-off device is ideal for patterning thick films such as thick metal and oxide films that are difficult to etch. ● Compatible with thin wafers! We often hear concerns that high-pressure jets might break thin wafers (substrates). We have a track record of lift-off with GaAs at a thickness of 120um (pressure 3MPa). Pressure adjustments can be freely made depending on the device. 【Features】 ■ Swelling comparable to DIP! ■ Ultra-high pressure jet with MAX 20MPa ■ Repeated processing of swelling and ultra-high pressure jet possible! ■ Burr removal ■ No metal reattachment ■ Usable for cleaning resist, polymers, and masks Please consider a demo first!
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basic information
【Main Specifications】 ■ Wafer Size: Compatible with φ2" to φ8" ■ Expansion Function: Pipe heater or temperature control liquid via recycling ■ Chemicals Used: Various stripping liquids such as DMSO, NMP ■ Equipment Size: 1500×1100×1900 (main unit with 3 cups) ■ Transport Method: Double-arm clean robot (CLASS1 compatible) ■ Fire Extinguisher System Many other options available! *For more details, please refer to the PDF document or feel free to contact us.
Price information
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Delivery Time
※4 to 5 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
VCSELs, LEDs, LDs, SAW filters, and MEMS are being adopted by various manufacturers.
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Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.
