X-ray observation device 'FX-500tRX/LL'

High output 130kV, 300uA can also penetrate metal substrates! Suitable for solder inspection machines for 3-layer and 4-layer power devices.

The "FX-500tRX" is an X-ray observation device that uses the "X-ray stereo CT method" to individually inspect the solder joints under the bus bar, under the power chip, and under the insulating substrate of power devices. When using the conventional principle of X-ray transmission, the solder joints under the chip and under the insulating substrate appear in the same position, causing the front and back to overlap, which prevents accurate inspection. The X-ray stereo method is a groundbreaking inspection device that allows for the separation and individual inspection of each solder joint. 【Features】 ■ High-output X-ray source of 130kV and 300uA capable of penetrating 5mm copper plates ■ Ultra-long life 1.3 million pixel X-ray flat panel significantly reduces running costs ■ Separation of the front and back surfaces of the mounted board using the X-ray stereo method (approximately 4 seconds) ■ Acquisition of 300 layers of horizontal cross-sections of the mounted board using the X-ray stereo CT method (approximately 50 seconds) ■ Automatic inspection using CT functionality (OK/NG judgment) *For more details, please refer to the PDF document or feel free to contact us.

X-ray inspection equipment