Short-time peeling! With our unique special nozzle, we have achieved high-speed processing, high peeling power, and low chemical consumption for lift-off using high-pressure jets!
Introducing a manual lift-off device that excels in research and development applications! It can shorten long processes, such as lift-off using ultrasound or spray after soaking overnight in acetone or a dedicated stripping solution. By utilizing our unique special nozzle with high-pressure jets, we achieve high-speed processing and strong stripping power with sheet processing, while also reducing the amount of chemical solution used. Furthermore, we have examples where the combination of our unique temperature control swelling and high-pressure jets has reduced processing time from 24 hours to just 3 minutes! In addition to metal and oxide film stripping, it can also be used as a cleaning device for resist, polymers, and masks, capable of stripping stubborn resist after thermal treatment or dry etching. Moreover, there are no issues with burrs or metal reattachment that can occur with DIP processing. This high-pressure jet lift-off device is ideal for patterning thick films, such as thick metal and oxide films, which are difficult to etch. 【Features】 ■ High-pressure jet capable of processing in a short time with a maximum of 20 MPa ■ Removal of burrs during lift-off ■ No metal reattachment ■ Resist stripping is also possible ■ Reduction of scratches with a unique recipe ■ Chemical recycling system (optional) Please consider a demo first!
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basic information
【Main Specifications】 ■ Wafer size: Compatible with φ2" to φ8" ■ Expansion function: Pipe heater or temperature control liquid via recycling ■ Chemicals used: Various stripping liquids such as DMSO, NMP ■ Equipment size: 1400×1100×1900 (main unit and chemical box integrated) ■ Transport method: Double-arm clean robot (CLASS 1 compatible) ■ Fire extinguisher system Many other options available! *For more details, please refer to the PDF document or feel free to contact us.
Price information
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Delivery Time
※3 to 4 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
We are adopted by various manufacturers for research and development, VCSEL, LED, LD, SAW devices, MEMS, etc.
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Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.
