High-pressure jet for high-speed resist stripping! Lift-off equipment for semiconductor manufacturing.
"Removal of metal and resist with ultra-high pressure jet" Achieve lift-off with high-speed processing, high stripping power, and low chemical consumption using the ASAP dedicated nozzle!
This is a super high-pressure jet lift-off device suitable for the difficult patterning of thick films, such as metal and oxide films, that are challenging to etch. Super high-pressure jet lift-off can effectively remove resist that has become difficult to remove due to heat or plasma! In the past, it was easily removed using the DIP process, but it has gradually become harder to remove... In response to the voices of such users, the super high-pressure jet lift-off device was developed! 【Features】 ■ Sprays a super high-pressure jet of up to 20 MPa ■ Removes burrs during lift-off ■ No re-adhesion of metal! ■ No risk of breaking even with thin wafers ■ Can also be used for cleaning resist, polymers, and masks ■ Chemical recycling system (optional) Some companies refer to increasing the pressure of a two-fluid spray as a high-pressure jet, but our super high-pressure jet operates at an impressive 20 MPa! Depending on how it is used, it can even etch glass. Of course, when used correctly in combination with our spin technology, stubborn resist can be easily removed. Additionally, there are no issues with burrs or re-adhesion of metal that can occur with DIP processing! Please consider a demonstration first!
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basic information
【Main Specifications】 ■Wafer Size: Compatible with φ2" to φ8" ■Expansion Function: Pipe heater or temperature control liquid via recycling ■Chemicals Used: Various stripping solutions such as DMSO, NMP ■Equipment Size: 1500×1100×1900 (main unit with 3 cups) ■Transport Method: Double-arm clean robot (CLASS1 compatible) ■Fire Extinguisher System Many other options available! *For more details, please refer to the PDF document or feel free to contact us.
Price information
We will provide you with the price according to the specifications.
Delivery Time
※4 to 5 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
VCSEL (surface-emitting LED), LED, LD (laser), SAW filter, MEMS, etc. are being adopted by various manufacturers.
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Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.