Process multiple sizes of wafers without changing setups! The multi-size compatible device achieves high productivity with minimal downtime for lift-off operations!
No need for setup changes due to different wafer sizes, leading to increased productivity! There is a strong demand for different inch sizes depending on the type of product, and a desire to handle larger wafer sizes in the future. Therefore, we offer a lift-off device that can process multiple sizes without the need for setup changes. 【Examples of compatible multiple sizes】 "2-3", "2-4", "3-4", "4-6", "6-8" inches 【Also compatible with thin wafers!】 We often hear concerns that high-pressure jets might break thin wafers (substrates). Our company has a proven track record of lift-off with GaAs wafers of 120um thickness (pressure 3MPa). Pressure adjustments can be freely made depending on the device. 【Benefits of no setup changes for multiple wafer sizes】 ■ Reduced downtime and high operational efficiency ■ Prevents damage to equipment and devices due to adjustment errors after setup changes ■ Reduces processing recipe selection errors with automatic wafer size recognition ■ Burr removal ■ No reattachment of metal Please consider a demonstration first!
Inquire About This Product
basic information
【Main Specifications】 ■ Wafer Size: Compatible with φ2" to φ8" ■ Expansion Function: Pipe heater or temperature control liquid via recycling ■ Chemicals Used: Various stripping liquids such as DMSO, NMP ■ Equipment Size: 1500×1100×1900 (body with 3 cups) ■ Transport Method: Double-arm clean robot (CLASS 1 compatible) ■ Fire Extinguisher System Many other options available! *For more details, please refer to the PDF document or feel free to contact us.
Price information
-
Delivery Time
※4 to 5 months (typically), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
VCSELs, LEDs, LDs, SAW filters, and MEMS are being adopted by various manufacturers.
catalog（1）
Download All Catalogs
Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.