Process multiple sizes of wafers without changing setups! The multi-size compatible device achieves high productivity with minimal downtime for lift-off operations!
No need for setup changes due to different wafer sizes, leading to increased productivity! There is a strong demand for different inch sizes depending on the type of product, and a desire to handle larger wafer sizes in the future. Therefore, we offer a lift-off device that can process multiple sizes without the need for setup changes. 【Examples of compatible multiple sizes】 "2-3", "2-4", "3-4", "4-6", "6-8" inches 【Also compatible with thin wafers!】 We often hear concerns that high-pressure jets might break thin wafers (substrates). Our company has a proven track record of lift-off with GaAs wafers of 120um thickness (pressure 3MPa). Pressure adjustments can be freely made depending on the device. 【Benefits of no setup changes for multiple wafer sizes】 ■ Reduced downtime and high operational efficiency ■ Prevents damage to equipment and devices due to adjustment errors after setup changes ■ Reduces processing recipe selection errors with automatic wafer size recognition ■ Burr removal ■ No reattachment of metal Please consider a demonstration first!
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basic information
【Main Specifications】 ■ Wafer Size: Compatible with φ2" to φ8" ■ Expansion Function: Pipe heater or temperature control liquid via recycling ■ Chemicals Used: Various stripping liquids such as DMSO, NMP ■ Equipment Size: 1500×1100×1900 (body with 3 cups) ■ Transport Method: Double-arm clean robot (CLASS 1 compatible) ■ Fire Extinguisher System Many other options available! *For more details, please refer to the PDF document or feel free to contact us.
Price information
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Delivery Time
※4 to 5 months (typically), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
VCSELs, LEDs, LDs, SAW filters, and MEMS are being adopted by various manufacturers.
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Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.
