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  6. X-ray imaging contract service for non-destructive testing of solder joint conditions, etc.

X-ray imaging contract service for non-destructive testing of solder joint conditions, etc.

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last updated:Apr 02, 2025

新日本電子 本社
新日本電子 本社
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We also accept X-ray imaging of equipment and embedded boards designed and manufactured by our company, as well as boards implemented by other companies. Please feel free to consult with us.

We will take images of areas that are difficult to observe through visual inspection, such as the solder joint condition of leadless components mounted on the substrate and cable disconnections, using the X-ray inspection equipment we possess, and provide you with the image data. Please use this for quality control of products and identification of defective areas. 【Examples】 ■ Confirmation of solder joint condition of BGA mounted on the substrate ■ Detection of defects in solder joints (unconnected, bridging, voids, etc.) ■ Pattern inspection and defect detection of printed circuit boards ■ Detection of disconnections in flexible substrates ■ Detection of disconnections in cables and harnesses ■ Observation of internal structures and defects of products and electronic components ■ Detection of foreign matter contamination inside products *For more details, please download the PDF or feel free to contact us.

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X-ray imaging contract service for non-destructive testing of solder joint conditions, etc.

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  • Special site - Product/service details - https://pr.mono.ipros.com/sndk/product/

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【Specifications of X-ray Inspection Equipment】 ■Manufacturer: SOFTEX ■Model Number: WORK-LEADER 100 ■Maximum Tube Voltage: 100 kV ■Maximum Tube Current: 0.1 mA ■Supported Board Size (Maximum): 250 mm × 250 mm *For more details, please download the catalog or contact us.

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X-ray imaging contract service for non-destructive testing such as solder joint condition and disconnection confirmation.

X-ray imaging contract service for non-destructive testing such as solder joint condition and disconnection confirmation.

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新日本電子

新日本電子 本社

Manufacturing and processing contract

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With over 30 years of experience in the design and production of systems, devices, packages, and modules centered around wireless technology through ODM, OEM, and EMS, we have provided products ranging from reliable devices to embedded products. We possess extensive experience in responding to both public market products and industrial market products, focusing on wireless technology, and accommodating a wide variety of low-volume embedded and standalone products. Furthermore, we offer comprehensive support not only in manufacturing but also in design, on-site adjustments and testing, maintenance, and repair. Moving forward, we will continue to support our customers in the IoT market with combinations of wireless and imaging technologies, as well as wireless and sensor technologies.

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