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  6. LED failure analysis

LED failure analysis

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last updated:Jun 26, 2025

アイテス
アイテス
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Applying advanced sample preparation techniques and failure analysis equipment for semiconductors! Investigating the causes of non-lighting and brightness degradation.

In our "LED Failure Analysis," we conduct failure analysis of LEDs using advanced sample preparation techniques and semiconductor failure analysis equipment to investigate the causes of non-lighting and brightness degradation. In the "LED Defect Mode Discrimination," we performed lighting tests after lens polishing and observed the resin of the LED, polishing it to stages a, b, and c, conducting lighting observations for (a) and (b), and optical observations of the chip through the resin for (c). Additionally, we also have categories such as "Electrical Normal" and "Open, High Resistance." 【Initial Diagnostic Items for LED Packages】 ■ Electrical Characteristics Measurement ■ Visual Inspection ■ Lens Polishing / Internal Optical Observation of the Package ■ Lighting Test (Brightness Distribution Observation) *For more details, please refer to the PDF document or feel free to contact us.

    Contract AnalysisAnalysis Services
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LED failure analysis

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  • Related Link - http://www.ites.co.jp/analyze/index.html
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X-ray fluoroscopy and CT examination device: Case of LED malfunction observation (X-ray fluoroscopy observation)

X-ray fluoroscopy and CT examination device: Case of LED malfunction observation (X-ray fluoroscopy observation)

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Total support service for LED.

Total support service for LED.

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LED failure analysis

LED failure analysis

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[Information] We will solve the cause of the issue from a chemical perspective.

[Information] We will solve the cause of the issue from a chemical perspective.

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[Dataset] LCD Panel Analysis Dataset

[Dataset] LCD Panel Analysis Dataset

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Examples of semiconductor observation through mechanical polishing.

Examples of semiconductor observation through mechanical polishing.

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Examples of semiconductor observation using mechanical polishing.

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In the methods for cross-section preparation in semiconductor structure observation and defect analysis, CP, FIB, and mechanical polishing are mentioned, each having its own advantages and disadvantages, making it necessary to consider which method to use. In recent years, CP and FIB have become more common, and it seems that the use of mechanically polished methods, which require technical skill, is decreasing. However, it is still not something to be dismissed. While there are merits and demerits, it is possible to achieve cross-section preparation with mechanical polishing that is on par with FIB and CP. At our company, based on years of accumulated know-how, we propose the most appropriate processing method according to the observation purpose, sample composition, and structure.

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アイテス

アイテス

Electronic Components and Semiconductors

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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