This is a high-precision die bonding machine with ultra-low load control, fully automatic operation, and compatibility with fine chips. *Technical materials are also available!
This is a die bonder device that supports various bonding processes for prototype development and high-yield manufacturing, particularly suitable for the assembly of optical components and optoelectronic components. It achieves a stable process manufacturing environment and employs a sealed enclosure that considers the safety of process gas usage and UV irradiation for operating personnel. 【Key Features】 • Mounting accuracy of 2μm@3σ • Multi-chip support • Cost-effective equipment configuration • Compatible with various assembly processes (adhesive, solder, thermal compression, ultrasonic) • Wide range of component supply methods (wafer, waffle pack, Gel-Pak) • Overlay vision alignment system (VAS) with fixed beam splitter • Fully automatic and manual operation *For more details, please download the PDF or contact us.
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*You can download the product catalog and technical documents. *For more details, please refer to the PDF materials or feel free to contact us.
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Company information
Fine Tech is a manufacturer of die bonders and flip chip bonders, headquartered in Berlin, Germany, specializing in the development, design, and manufacturing of high-precision die bonding equipment, consistently providing cutting-edge assembly technology. We strive to support all our customers, ranging from venture companies to multinational corporations, universities, and government agencies, across various fields including electronics, electronic devices, optical components, aerospace, medical, and military. Fine Tech Japan Co., Ltd. was established on August 1, 2014, as a base for sales and application support related to die bonding for Japanese customers, and we are actively working to provide the latest assembly technology to our customers in Japan.