Demonstrates excellent high-precision mounting accuracy in mass production and prototype development. *Technical materials related to bonding are currently being distributed.
The "FINEPLACER femto2" is a fully automatic high-precision die bonding machine that achieves a mounting accuracy of 0.3μm @ 3 sigma. It supports various mounting methods such as thermal eutectic, ultrasonic, and more, ensuring a consistently stable assembly process even when transitioning from product development to full-scale manufacturing. 【Features】 ■ High-precision alignment with UHD vision alignment system ■ Integrated process management for quick adaptation to multiple mounting processes ■ Compatible with various mounting processes (thermal compression, soldering, adhesives, ultrasonic, etc.) ■ Modular system design allows for diverse configurations ■ Process environment managed with cleanroom quality ■ Equipped with three-color LED lighting for excellent visibility and image recognition ■ Intuitive operation via touch screen panel *You can view product materials and technical documents related to bonding by downloading the PDF. Please feel free to contact us with any inquiries.
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【Main Specifications】 Mounting Accuracy: ±0.5μm @ 3 Sigma Optical Field of View: 3.8mm × 2.7mm Optical Field of View Resolution: 1μm / pix Supported Chip Size: (Minimum) 0.03mm × 0.03mm to (Maximum) 100mm × 100mm θ Fine Adjustment: ±9° / 3.5μrad X Movement/Accuracy: 660mm / 0.02μm Y Movement/Accuracy: 150mm / 0.02μm Z Movement/Accuracy: 10mm / 0.02μm Substrate Heating Temperature: 500℃ Bonding Load Range: 0.05N to 1000N *For more details, please refer to the documentation. Feel free to contact us with any inquiries.
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Company information
Fine Tech is a manufacturer of die bonders and flip chip bonders, headquartered in Berlin, Germany, specializing in the development, design, and manufacturing of high-precision die bonding equipment, consistently providing cutting-edge assembly technology. We strive to support all our customers, ranging from venture companies to multinational corporations, universities, and government agencies, across various fields including electronics, electronic devices, optical components, aerospace, medical, and military. Fine Tech Japan Co., Ltd. was established on August 1, 2014, as a base for sales and application support related to die bonding for Japanese customers, and we are actively working to provide the latest assembly technology to our customers in Japan.