Supports high-precision stacked packages such as NAND flash.
The needleless pickup system can pick up ultra-thin chips without damage. World-class bonding precision ~ High precision XY: ±8μm θ: ±0.05 (3σ) ~ Versatile handling ~ Compatible with sizes from 1.0 to 25.0mm and substrate sizes from 100 to 315mm ~
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basic information
12-inch wafer high-precision stack compatible die bonder
Price information
-
Price range
P7
Delivery Time
Applications/Examples of results
NAND flash, etc., for stacked bonding.
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Company information
Since its founding in 1972, our company has upheld the management philosophy of "creativity, sincerity, and challenge." We have been committed to sincerely creating solutions for our customers' needs from their perspective, and at times, we have embraced challenges without fear of failure. With this policy, we have dedicated ourselves to the development of advanced production systems through company-wide efforts to refine our technology. As a result, we have grown into a reliable company with outstanding mechatronics technology and have contributed to the development of the industrial sector. Now, aiming to be a "company that continues to shine in the 21st century," all of our employees are challenging themselves to create and provide further advanced intellectual production systems from the customer's viewpoint and to contribute to society.
