Provided with specifications tailored to customer needs and existing equipment for both rough grinding and fine grinding!
The "Ingot Peripheral Grinding Wheel" is a wheel for peripheral grinding and orientation flat surface processing. The metal bond designed for silicon ingot processing has excellent wear resistance and a good balance of self-sharpening action, allowing for stable grinding performance and longer dressing intervals, resulting in overall cost reduction. Additionally, the high-precision finished grinding surface processes the ingot surface to a high flatness. 【Standard Specifications (Excerpt)】 ■ Grain Size ・Coarse Grinding: #60 to #80 ・Fine Grinding: #140 to #200 ■ Concentration: 75 to 100 ■ Bond: Metal *For more details, please refer to the PDF document or feel free to contact us.
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【Other Standard Specifications】 ■Outer Diameter: 78–120mm ■Diamond Layer Width: 6–9mm ■Diamond Layer Thickness: 8–10mm *For more details, please refer to the PDF document or feel free to contact us.
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【Processing Examples】 <Coarse Grinding> ■Grain Size: #80 ■Surface Roughness (Ra): - <Fine Grinding> ■Grain Size: #140 ■Surface Roughness (Ra): 1.0 (0.8) *Maximum Value (Average Value) *For more details, please refer to the PDF document or feel free to contact us.
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Adamas Corporation manufactures and sells industrial diamond grinding wheels. Since its establishment, we have earned the trust of our customers by aiming for high quality, short delivery times, and low costs. We will continue to focus on each product to ensure customer satisfaction.
