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  6. Non-contact thickness measurement optical sensor "CHRocodile 2 Series"

Non-contact thickness measurement optical sensor "CHRocodile 2 Series"

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last updated:Mar 30, 2022

プレシテック・ジャパン
プレシテック・ジャパン
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A wide range of probes that can measure with high precision from thin films (a few micrometers) to thick films (780 micrometers). Suitable for wafer inspection applications as well.

The "CHRocodile 2 series" is a non-contact sensor capable of in-process measurement of wafer thickness with sub-micron resolution. It is also used for quality control through sampling. In addition to the semiconductor industry, it is adopted in consumer electronics, glass manufacturing, and the medical field, making it suitable for measuring the thickness of transparent materials, coating thickness, and simultaneous measurement of multiple layers (up to 16 layers). 【Features】 - Wide range of thickness measurement, compatible with various materials A rich lineup of probes covers thickness from thin films (a few micrometers) to thick films (780 micrometers). Two principle methods can be selected according to the material. - High resolution (sub-micron, minimum 1nm) High-resolution measurements based on "chromatic aberration confocal method" and "spectral interference method." - Contributes to reducing development costs and shortening development lead times, with a software development kit (DLL, etc.) available for equipment integration. - Extensive track record across multiple industries Semiconductor industry, consumer electronics, glass manufacturing, medical field. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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Non-contact thickness measurement optical sensor "CHRocodile 2 Series"

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【Lineup】 <CHRocodile 2 DPS (Chromatic Aberration Confocal Method)> - Light source: White LED - Measurement range from 100μm to 38.5mm using a probe - Capable of measuring overall thickness regardless of material <CHRocodile 2 IT (Spectral Interference Principle Method)> - Light source: Infrared SLD - Capable of measuring thickness up to 16 layers - Compatible with polished wafers <CHRocodile 2 DW (Spectral Interference Principle Method)> - Light source: Infrared SLD - Supports a wide range of thicknesses - Compatible with doped wafers *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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Applications/Examples of results

[Keywords: Applications, Measurement Items, Benefits, etc.] Non-contact sensors, optical sensors, confocal, spectral interference method, thickness, thin films, thick films, gaps, height, surface roughness, flatness, TTV, shape, appearance, edges, slopes, measurement, inspection, high speed, 3D, high precision, inline, monitoring, in-situ, during processing, before and after processing, polishing, offline, standalone machines, tabletop machines, sampling, embedded, semiconductors, wafers, wafer bonding, Si wafers, CMM, welds, glass, quartz glass, silica glass (medical ampoules), display glass, car windshields, PCBs, medical balloons, barrier films, PET films, coatings, films, multilayer films, applied films, conformal coatings, electrode layer coatings, stent coatings, polyimide, PVB, resin materials, flux, adhesives, insulating films, air layers, dicing grooves, flip chips, wire bonders, microbumps, transparent, transparent bodies, black, glossy, mirror finish, easy.

catalog(7)

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Proposal for Non-Contact Wafer Thickness Measurement Sensor During In-Process for Semiconductors

Proposal for Non-Contact Wafer Thickness Measurement Sensor During In-Process for Semiconductors

OTHER
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Prestech Sensor - Usage Examples for Batteries

Prestech Sensor - Usage Examples for Batteries

TECHNICAL
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Thickness measurement application

Thickness measurement application

TECHNICAL
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Solutions for Semiconductor Pretech Products_20220628

Solutions for Semiconductor Pretech Products_20220628

TECHNICAL
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Case Study Collection: Thickness Measurement and 3D Shape Measurement of Semiconductor Wafers Using Non-Contact Sensors

Case Study Collection: Thickness Measurement and 3D Shape Measurement of Semiconductor Wafers Using Non-Contact Sensors

TECHNICAL
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Prestech's lineup of non-contact thickness measurement sensors

Prestech's lineup of non-contact thickness measurement sensors

CATALOG
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Utilization in the grinding process

Utilization in the grinding process

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Company information

プレシテック・ジャパン

プレシテック・ジャパン

Testing, Analysis and Measurement

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Presitech is a specialist in laser material processing and optical measurement technology. We are not just a supplier of systems and components, but a professional partner in ensuring a smooth processing process for our customers. We offer consultations from the foundational stage and accurately consult with customers on their requests and objectives. We understand that the key to success in unique processing processes lies in the four components of exhibition, monitoring, processing, and control. Only by doing so can we provide appropriate solutions for our customers' applications. Our high-quality products, such as laser processing heads, quality monitoring systems, and optical measurement systems for spacing/thickness measurement, allow customers to directly benefit from our decades of experience. Our optical sensors are characterized by the highest precision and dynamic adaptability. Furthermore, they detect accurate values even in high-speed measurements.

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