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EPMA analysis

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last updated:Jun 26, 2025

アイテス
アイテス
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Supports 100×100mm size! The movable stage allows for extensive mapping.

EPMA analysis has good energy resolution and detection sensitivity, and is particularly excellent for quantitative analysis of trace components and map analysis. It can accommodate sizes of 100×100mm, allowing for extensive mapping. In the example of foreign substance analysis on indium-tin oxide thin films, it showed better energy resolution, detection limits, and PB ratio compared to SEM-EDX. Additionally, it enables the detection of trace elements and analyses that are difficult to perform with SEM-EDX. 【Features】 ■ Good energy resolution and detection sensitivity ■ Particularly excellent for quantitative analysis of trace components and map analysis ■ Wide-range mapping possible with movable stage ■ Compatible with sizes of 100×100mm *For more details, please refer to the PDF document or feel free to contact us.

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EPMA analysis

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  • Related Link - https://www.ites.co.jp/section/index.html
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【Device Specifications】 ■ Manufacturer: JEOL Ltd. Jeol-8200 ■ Analysis Method: Wavelength Dispersive X-ray Analysis (WDX) ■ Analyzable Elements: B to U ■ Energy Resolution: 20 eV (EDX is approximately 130 eV) ■ Detection Limit: 0.01% and above ■ Maximum Sample Size: 100×100 mm *For more details, please refer to the PDF document or feel free to contact us.

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EPMA analysis

EPMA analysis

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[Analysis Example by EBSD] Chip

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[Example of analysis using EBSD] Screw

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[Example of analysis using EBSD] Pipe

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[Example of analysis using EBSD] Via

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[Example of Analysis by EBSD] High Melting Point Solder

[Example of Analysis by EBSD] High Melting Point Solder

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Example of analysis using EBSD: steel plate

Example of analysis using EBSD: steel plate

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Crystal analysis by EBSD BGA

Crystal analysis by EBSD BGA

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Crystal analysis by EBSD: Intermetallic compounds in solder joints

Crystal analysis by EBSD: Intermetallic compounds in solder joints

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EBSD analysis

EBSD analysis

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Crystal analysis of Cu using the EBSD method.

Crystal analysis of Cu using the EBSD method.

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Example of analysis using the EBSD method

Example of analysis using the EBSD method

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EBSD analysis of flexible printed circuits (FPC)

EBSD analysis of flexible printed circuits (FPC)

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Example of analysis using EBSD (ceramics)

Example of analysis using EBSD (ceramics)

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Example of analysis using EBSD (whisker)

Example of analysis using EBSD (whisker)

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[Example of analysis using EBSD] Crab claw

[Example of analysis using EBSD] Crab claw

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Total support service for cross-section grinding, processing, observation, and analysis.

Total support service for cross-section grinding, processing, observation, and analysis.

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Detection sensitivity due to differences in acceleration voltage during SEM-EDX analysis.

Detection sensitivity due to differences in acceleration voltage during SEM-EDX analysis.

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[Data] Example of EPMA Analysis

[Data] Example of EPMA Analysis

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[Data] EPMA Analysis Example 2

[Data] EPMA Analysis Example 2

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Example of EPMA analysis using the guide network map method.

Example of EPMA analysis using the guide network map method.

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Company information

アイテス

アイテス

Electronic Components and Semiconductors

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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