Special processing such as ZAGRI processing, laser processing, and high-precision processing for pattern alignment is possible!
Our company handles special processing of "high-precision substrates for high-precision devices." The accuracy of the counterbore processing is ±20μm, the high-precision outer diameter processing by laser is ±10μm, and the high-precision processing for pattern alignment is ±50μm. By installing ICs in the counterbore section, it is possible to keep the height of the substrate low after mounting. 【High-Precision Processing】 ■ Counterbore processing accuracy: ±20μm ■ High-precision outer diameter processing by laser: ±10μm ■ High-precision processing for pattern alignment: ±50μm *For more details, please refer to the PDF document or feel free to contact us.
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basic information
With the ability to achieve high-precision recesses, it has become possible to expose the inner layers of the substrate and implement electronic devices on top of them. As a result, advanced heat dissipation measures have become feasible. The base materials can range from standard FT4 to low dielectric materials, or even fluoropolymer substrates. Our company offers all of these base materials, including overseas options. While the performance is equal to or better than domestic materials, we can provide them at a lower cost.
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Applications/Examples of results
LED flashlight module DC/DC converter module Other small electronic modules in general
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Company information
Morimar SSP Co., Ltd. is engaged in the development, manufacturing, processing, and sales of various synthetic resins and chemicals, as well as their raw materials. Utilizing the production systems of the Morimar Group both domestically and internationally, we are expanding our global initiatives across a wide range of products, including FRP raw materials and molded products, glass fibers, printed circuit boards, resin raw materials, and functional films, targeting markets both in Japan and abroad.
