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  6. [Information] Cross-section production method

[Information] Cross-section production method

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last updated:Jun 26, 2025

アイテス
アイテス
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We are publishing the main cross-section manufacturing methods, processing conditions, advantages & disadvantages, etc.!

This document introduces methods for preparing cross-sections. When conducting observations, analyses, or evaluations, there may be a need to prepare cross-sections. By selecting or combining methods that are appropriate for the purpose, material, and structure, it is possible to obtain highly reliable results. In mechanical processing, we include main cross-section preparation methods such as "mechanical polishing" and "microtome." In ion beam processing, methods like "FIB" and "ion polisher (CP)" are also featured. We encourage you to read it. [Contents] ■ Main cross-section preparation methods ■ Processing conditions ■ Advantages & disadvantages *For more details, please refer to the PDF document or feel free to contact us.

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[Information] Cross-section production method

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  • Related Link - http://www.ites.co.jp/analyze/index.html
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[Data] Cross-section production method

[Data] Cross-section production method

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Observation of the coating layer of eyeglass lenses using a microtome.

Observation of the coating layer of eyeglass lenses using a microtome.

TECHNICAL
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Cross-sectional observation by SEM: Connector plating

Cross-sectional observation by SEM: Connector plating

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Observation of the coating film

Observation of the coating film

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Case study of fisheye analysis of laminate film.

Case study of fisheye analysis of laminate film.

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Case Study of Foreign Matter Analysis in Laminating Film

Case Study of Foreign Matter Analysis in Laminating Film

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The microtome's blade (knife) is its lifeline.

The microtome's blade (knife) is its lifeline.

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Introduction to Section Processing and Observation Methods

Introduction to Section Processing and Observation Methods

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Examples of semiconductor observation through mechanical polishing.

Examples of semiconductor observation through mechanical polishing.

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Optical film light transmission characteristics

Optical film light transmission characteristics

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Cryogenic ion milling cross-section processing example (rubber products)

Cryogenic ion milling cross-section processing example (rubber products)

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Effects of heat generated during cross-sectional ion milling (CP) processing.

Effects of heat generated during cross-sectional ion milling (CP) processing.

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Cryogenic ion milling cross-section processing example (rubber products)

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We will introduce a case where cross-sections were created and observed by method regarding the adhesive parts of the tires of pull-back cars. When conducting SEM observations of the created cross-sections, fillers present inside the rubber were confirmed. It was found that the dispersion state of the fillers and the condition of the adhesive interface were not clear with fracture by liquid nitrogen or mechanical polishing. In contrast, the cross-sections created by cryo ion milling allow for clear observation of the dispersion state of the fillers contained within the rubber and the condition of the adhesive interface with the plastic substrate.

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Optical film light transmission characteristics

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At Aites Co., Ltd., we conduct "optical film analysis." Optical films used in smartphones and other devices have various functions depending on their structure and materials. We measured the light transmittance of privacy protection films at different angles and combined cross-sectional observation with Raman analysis to investigate the mechanism of function manifestation. By investigating the transmittance characteristics of privacy protection films using angle-variable spectrophotometry, we were able to analyze the mechanism of function manifestation through cross-sectional observation and Raman analysis. At Aites, we provide consistent evaluation and analysis from material properties to the mechanisms of function manifestation.

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Examples of semiconductor observation using mechanical polishing.

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In the methods for cross-section preparation in semiconductor structure observation and defect analysis, CP, FIB, and mechanical polishing are mentioned, each having its own advantages and disadvantages, making it necessary to consider which method to use. In recent years, CP and FIB have become more common, and it seems that the use of mechanically polished methods, which require technical skill, is decreasing. However, it is still not something to be dismissed. While there are merits and demerits, it is possible to achieve cross-section preparation with mechanical polishing that is on par with FIB and CP. At our company, based on years of accumulated know-how, we propose the most appropriate processing method according to the observation purpose, sample composition, and structure.

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アイテス

アイテス

Electronic Components and Semiconductors

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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