Localized heating device

Added to bookmarks
Bookmarks list

Bookmark has been removed
Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.
Free membership registration

last updated：Nov 19, 2020

Official site

Rework of narrow pitch mounting boards! It is possible to achieve mounting with minimal thermal impact on surrounding components.

The "local heating device" is a machine used for soldering surface mount components such as small BGAs and CSPs using halogen heaters and hot air. It is easy to protect components that should not be overheated, can accommodate complex temperature profiles, and is also compatible with double-sided mounted boards with encapsulants. We have a track record of over 500,000 reworks. 【Features】 ■ Compact and energy-efficient ■ Capable of handling complex temperature profiles ■ Easy to protect components that should not be overheated ■ Compatible with double-sided mounted boards with encapsulants ■ Flexible in accommodating various types of boards and components for development and repair ■ Designed to reduce profile selection errors *For more details, please refer to the PDF materials or feel free to contact us.

Related Link - https://www.okksg.co.jp/product/equipment/solderin…

Inquire About This Product

basic information

【Specifications】 ■Dimensions: W220×D345×352 (mm) ■Main Heater: Halogen lamp, maximum output 150W ■Preheater: Hot air type, 200W ■Heating Rate: 0.5°C/second to a maximum of 20°C/second (using our test board) ■Maximum Temperature: Approximately 500°C (using our test board) ■Supported Board Size: 50×50×1 to 85×105×5 (mm) ■Supported Component Size: 5×5 to 20×20t<5 (mm) ■Power Supply: AC100V 50/60Hz 4A *For more details, please refer to the PDF document or feel free to contact us.