Introduction to Cooling Technology: Slim Vapor Chamber

Vapor chambers are starting to be used in mobile devices instead of heat pipes!

With the miniaturization and high performance of electronic devices, the power consumption and heat generation are also increasing. The heat transfer capacity of heat pipes is insufficient, and vapor chambers are beginning to be used in mobile devices as a substitute for heat pipes. We offer "Slim Vapor Chambers" with thicknesses of 0.4mm, 0.3mm, and 0.25mm for use in mobile devices. 【Slim Vapor Chamber Specifications (Excerpt)】 <Maximum design dimensions are uniformly 100×100mm> ■ Thickness 0.3mm (Input heat capacity 5.5W) ■ Thickness 0.35mm (Input heat capacity 9W) ■ Thickness 0.4mm (Input heat capacity 9W) ■ Thickness 0.45mm (Input heat capacity 12W) ■ Thickness 0.5mm (Input heat capacity 14W) *For more details, please refer to the PDF document or feel free to contact us.

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