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  6. Electrolytic/non-electrolytic plating equipment

Electrolytic/non-electrolytic plating equipment

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TEAM / TESM / TEMM Series

last updated:Jan 14, 2022

東設 本社ヘッドオフィス
東設 本社ヘッドオフィス
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We offer a unique plating process tailored just for you, with keywords such as magnetic films, high-speed plating, uniform film thickness, and custom-made.

Regardless of the type of solution, we can propose plating equipment and processes tailored to your objectives. Most of the ordered equipment will have original specifications, allowing us to provide the equipment you desire. 1. Four types of plating methods: Supporting plating methods and processes according to your objectives. 2. Film thickness uniformity within ±2%: Face-up method. 3. Magnetic film plating compatible with all compositions: Production of plating solutions and film formation compatible with all compositions. 4. Supplied to all companies in the HDD industry: Magnetic film plating equipment.

    CapacitorInductor CoilOscillator
めっき装置.png

Electrolytic/non-electrolytic plating equipment

めっき装置.png
めっき装置.png
  • Related Link - https://www.tosetz.com/plating

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basic information

We propose four types of plating tanks according to the customer's purpose: face-up type, face-down type (cup type), vertical dip type, and rise-up type for electroplating and electroless plating. - Customization to fit the process - Compatible with various wafers from 4 to 12 inches - Face-up, face-down type (cup type), vertical dip type, rise-up type - Fully automatic, semi-automatic, manual, tabletop type

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Applications/Examples of results

The electroplating and electroless plating equipment from Higashi Design is compatible with various substrates and new technologies. Below are some representative applications. ■ Magnetic materials, Ni-Fe (permalloy, invar), Fe-Ni-Co, etc. ■ Cu, Ni, Au, Ni ■ Solders, Alloys ■ Pads, Lines ■ Pillars, Bumps, etc. ■ TSV ■ Barrier layer and seed layer ■ UBM ■ Wafer level packaging ■ FOWLP, FOPLP

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Tosetsu Co., Ltd. Plating Equipment - Japanese Version

Tosetsu Co., Ltd. Plating Equipment - Japanese Version

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Tosetsu Co., Ltd. Company Profile - Japanese Version

Tosetsu Co., Ltd. Company Profile - Japanese Version

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Company information

東設

東設 本社ヘッドオフィス

Electronic Components and Semiconductors

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Tosetsu is a development-oriented equipment venture that provides equipment primarily for semiconductor, electronic device, and LCD manufacturers, including "automatic electroplating/non-electroplating plating equipment," "exhaust gas treatment equipment," "wet process equipment," and "degasification systems." In addition to design development and manufacturing sales, we also offer process support & consulting, demonstration, prototyping, contract processing, and maintenance modification services. We look forward to your contact with Tosetsu, a venture that loves free thinking.

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