It is possible to form copper electrode patterns with a thickness of approximately 100um in fine pitch!
This is an introduction to a manufacturing case where thick copper patterns were formed on ceramic substrates to meet the needs of high current and high heat dissipation. By using a thin film process, it is possible to create copper electrode patterns with a thickness of approximately 100um in fine pitch. Please feel free to consult us when needed. 【Case Overview】 ■Material: Alumina, Aluminum Nitride ■Film Structure: Ti/Cu/Ni/Au ■Copper Thickness: up to 100um ■L/S: 120/120 (Copper thickness 100um) *For more details, please refer to the PDF document or feel free to contact us.
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![[Case Study of Circuit Board Manufacturing] Thick Film Circuit Board](https://image.mono.ipros.com/public/product/image/ed8/2000570858/IPROS43943229348856338187.png?w=280&h=280)
