Introduction of small glass substrate appearance inspection equipment and six-sided appearance inspection equipment for electronic components.
Dainichi Shoji Co., Ltd. introduces the "Inspection Equipment" it handles. The "Wafer and Chip Appearance Inspection Equipment" achieves labor-saving with high-speed throughput and is capable of inspecting micro-cracks, foreign substances, and pattern defects. The "Small Glass Substrate Appearance Inspection Equipment" can detect minute scratches and dirt on small glass substrates such as those used in smartphones. Additionally, we also handle the "Electronic Component 6-Surface Appearance Inspection Equipment," which can perform high-speed inspection of chip components from six sides, processing approximately 1,500 pieces per minute. 【Wafer and Chip Appearance Inspection Equipment Features】 ■ Compatible with 2-inch to 12-inch sizes ■ Supports Si wafers, compounds, glass, etc. ■ Inspection of warped wafers and chips after dicing ■ Automatic discrimination function / Map data storage function ■ Resolution: 1.5μm *For more details, please refer to the PDF document or feel free to contact us.
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【Other Features】 ■ Small Glass Substrate Appearance Inspection Device - Inspects and determines pass/fail while transporting one piece at a time on an automatic conveyor - Simultaneous inspection of both sides of the glass / option for single-side inspection ■ Electronic Component Six-Sided Appearance Inspection Device - High-speed six-sided inspection of chip components (scratches, dirt, chipping, length, width) - Capable of processing approximately 1500 pieces per minute - Appearance inspection of chip capacitors, chip resistors, and other electronic components - Touch panel operation (color inspection available as an option) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Dainichi Shoji Co., Ltd. was established in 1959 as an import trading company and has since provided products such as temperature sensors, plastic products, consumables, and equipment for the electronics (semiconductor and LCD) industry. In 1997, we established a plastic molding factory in Yonezawa City, Yamagata Prefecture, creating a corporate structure that combines trading and manufacturing functions. At the core of our operations is our "spirit of challenge" to quickly respond to customer requests and problem-solving, along with our commitment to manufacturing. To survive in the rapidly changing electronics industry, we continuously anticipate market demands and diligently strive to provide excellent technology and high-quality products, aiming to be a company trusted by society.
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