Plating technology for fine and precise sealing components (sealing components such as quartz devices)
A technology that can electroplate a large number of extremely thin and fine flat metal products (nickel and gold plating)! Comprehensive measures against contamination such as dust are also in place!
It is utilized as a plating for metal processed products that serve as "covers" to seal ceramic packages for mainly crystal devices, SAW filters, and various sensors, processing hundreds of millions of units per month. The size is small, measuring 1.47×1.07mm (0.05t). Even with large-scale processing, there is almost no "overlap" caused by plating. For press-cut products, plating treatment resolves issues such as "remaining overlap marks or incomplete coverage" and "drying stains." Additionally, contamination countermeasures are well-developed, assuming post-processing will be implemented and assembled in a clean room. 【Burr Countermeasures by Pressing】 Resolved through a unique chemical polishing treatment. 【Ensuring Solder Wetting Properties】 - Introduction of a unique plating solution management method through dedicated line processing. - If necessary, an additional treatment process to enhance wettability can be added. 【Types of Plating】 1. Nickel Plating (Ni, Ni-p) Finish Electrolytic plating: Matte Electroless plating (Ni-p: medium phosphorus type): Glossy 2. Gold Plating (Au) Finish Electrolytic plating: Matte (soft)
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basic information
【Target Materials】 Cobalt material (KOV), iron-based materials (Fe, alloys, etc.), aluminum (AL) *Please consult us for materials other than the above. 【Packaging Form and Contamination Measures】 - "Bagged" or "Vacuum Packed" → Sealed with heat sealing - Static electricity measures implemented during inspection to packaging process - Contamination checks conducted during vacuum packaging - Heat treatment available upon request, etc. 【Inspection Items】 - Visual inspection - Film thickness inspection - Solder wettability test - Measurement of product dimensions (thickness, outer diameter), etc.
Price information
At any time, your estimate.
Delivery Time
※It varies depending on the content and quantity. Please contact us.
Applications/Examples of results
Electrolytic and electroless nickel plating and gold plating for metal plates used for sealing ceramic packages such as crystal devices. Products with overlapping shapes such as contacts, connectors, and spring terminals for various low-voltage components like communication equipment and automotive parts.
Company information
The slogan is "Challenge the Impossible." We are a technology development-oriented company that broadly develops unique surface treatment technologies to meet the special needs required for essential low-voltage components (related to electricity, electronics, and semiconductors), high-voltage components (such as high-voltage connectors), and insulating components. Additionally, we have established a support system that incorporates functional surface treatments, which we have cultivated since our founding, as our core technology, along with processes such as pressing, heat treatment, painting, and assembly. We will continue to deliver consistent Yuden-sha brand technologies and products to the world. *We support online business meetings.
