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  5. Printed Circuit Board
  6. Printed circuit boards, various devices, communication equipment, industrial machinery, PCs, etc., repair and preventive maintenance.

Printed circuit boards, various devices, communication equipment, industrial machinery, PCs, etc., repair and preventive maintenance.

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last updated:May 13, 2025

ビオラ
ビオラ
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Poor implementation, the device does not operate, error display, communication has become impossible... We will improve it.

Printed circuit boards can experience various issues due to component defects, aging deterioration, vibrations, temperature and humidity effects, and more. We identify the specific locations on the board where problems are occurring and repair them using our years of experience, extensive knowledge, and specialized equipment, from sourcing parts to replacement. If desired, we also offer preventive maintenance by replacing consumable parts. We can also repair patterns on boards that have suffered partial burn damage. Additionally, if you encounter issues with rework, such as needing to correct just one board, not having the manpower to dedicate to rework, or facing high difficulty levels, we can provide quick turnaround, high-quality repairs without discarding the board or components. Using IR equipment and rework tools, we can add and retrofit all types of components (LEDs, connectors, and all surface-mounted and through-hole components). Please feel free to consult with us.

    Printed Circuit Board
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Printed circuit boards, various devices, communication equipment, industrial machinery, PCs, etc., repair and preventive maintenance.

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  • Related Link - http://violaq.co.jp/business_kaiseki.html

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basic information

For more details, please refer to the PDF document or feel free to contact us.

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Substrate repair, rework, assembly

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ビオラ

ビオラ

Electronic Components and Semiconductors

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The impetus for our work on BGA rework was "environmental protection." Starting around 2002, we began to see a significant number of circuit board repairs that were impossible to fix while conducting mobile phone repair operations. When BGA (IC) was incorporated into mobile phones, adhesive (underfill) was used as a measure to prevent solder peeling. This adhesive reinforces the bonding between the circuit board and the IC, but due to aging and usage conditions such as drops, it can surprisingly crack easily. Later, these cracks can erode the solder of the IC, leading to functional failures. Since mobile phone circuit boards have many functions, the disposal cost for a single unit can be enormous. If IC replacement becomes possible, repairs can be conducted with just the cost of the IC and its replacement, allowing other components to be reused, which we believe connects this recycling technology to "environmental protection." Our company has been committed to creating a more environmentally friendly world through circuit board modification, repair, BGA reballing, and component regeneration long before the term SDGs became widely recognized, emphasizing the importance of the global environment.

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