Leak-free, clean, and lightweight compact resin fusion joints! Significantly reduces piping space and makes it easy to insert sleeves straight, preventing construction mistakes.
The "TBN Series" is a leak-free, clean, lightweight, and compact resin welded joint. It has no sliding parts on the inner surface of the connection, which excels in particle characteristics, and provides a complete seal through butt welding of the joint and tube end faces, eliminating the need for re-tightening and concerns about liquid leakage. Additionally, by extending the tube section, it allows for direct installation of sleeve press-fit type joints, achieving reduced construction time and compact piping design. 【Features】 ■ Leak-free, clean, lightweight, and compact ■ Easy to achieve the shortest welding ■ Direct press-fitting of sleeves possible ■ "Piping kits" with TBN joints and PFA tubes are available *KITZ SCT offers various solutions for fluid-related issues in semiconductor manufacturing. For more details, please refer to the PDF materials or feel free to contact us.
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【Other Features】 ■ The welded part is stronger than the tube section, preventing breakage or rupture of the weld. ■ High heat resistance is ensured, with no loosening or leakage due to thermal cycling. ■ The maximum operating temperature is 200°C, ensuring high heat resistance, and there is no loosening or leakage due to thermal cycling. ■ The lightweight and compact fittings significantly reduce piping space. ■ With the newly added boss, customers can perform welding without any clamping dimensions, allowing for a compact piping layout. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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KITZ SCT combines a wide range of technologies, including metal processing and welding techniques, a spacious and clean environment, ultra-precision cleaning systems, and uniquely developed ultra-precision polishing technology, to develop, manufacture, and provide sales services for various piping components used in semiconductor manufacturing, from vacuum to high-pressure systems. Additionally, we incorporate strict quality control systems, including ISO standards and high-pressure gas certification, aiming for comprehensive cleanliness through all analyses and evaluations from material analysis to process/final products, always responding to the needs of the times.