Water is effective for reduction and bonding. Let me introduce a groundbreaking plasma treatment device.
"Aqua Plasma" is a new treatment method that uses water vapor (H2O). It enables efficient and safe reduction of oxidized metals, resin bonding, hydrophilization, and decomposition of organic substances. We offer a lineup including the space-saving model "AQ-500," the large-area substrate compatible model "AQ-2000," and the magazine model "AQ-100M." 【Lineup】 ■ Space-saving model AQ-500 ■ Large-area substrate compatible model AQ-2000 ■ Φ8″ double cassette model AQ-200C ■ Magazine model AQ-100M *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Product Features】 <Space-Saving Model AQ-500> ■ Safe reduction of metal oxide films and cleaning of organic substances ■ Room temperature bonding of resins and super hydrophilicity ■ Space-saving all-in-one design (500 mm (W) x 650 mm (D)) ■ One-touch activation of the steam generation unit *For more details, please refer to the PDF document or feel free to contact us.*
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Applications/Examples of results
【Application Examples】 <Space-Saving Model AQ-500> ■ Surface reduction, modification, and cleaning of silver electrodes ■ Surface reduction, modification, and cleaning of copper electrodes ■ Room temperature bonding of resin and glass (adhesive-free), microfluidic chip applications ■ Surface modification and superhydrophilicity of resin *For more details, please refer to the PDF document or feel free to contact us.
Company information
We excel in the technology of thin film formation and processing at the nano to micro level, and we are well-regarded for providing equipment and technology for both research and development applications as well as production purposes. Additionally, we specialize in the optoelectronics field, particularly in light sources (LEDs and semiconductor lasers), which are expected to see market expansion in the future.
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