A versatile dry etching device boasting hundreds of successful installations.
● High selection ratio and high-precision etching are possible. ● Automatic operation and process parameter storage are possible with PLC control. ● Samples up to φ8 inches can be accommodated. ● High-speed exhaust etching is possible. ● Compact design.
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basic information
The RIE-10NR is a reactive ion etching device designed for high-precision etching of various silicon thin films such as Si, Poly-Si, SiO2, and Si3N4. This device offers excellent cost performance, as it is low-priced yet capable of managing various etching conditions through the integrated PLC.
Price information
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Applications/Examples of results
- High-precision etching of various silicon thin films such as Si, Poly-Si, SiO₂, and SiN - Fabrication of semiconductor lasers - Defect analysis
Company information
We excel in the technology of thin film formation and processing at the nano to micro level, and we are well-regarded for providing equipment and technology for both research and development applications as well as production purposes. Additionally, we specialize in the optoelectronics field, particularly in light sources (LEDs and semiconductor lasers), which are expected to see market expansion in the future.
