Wide-ranging support! Ultra-compact, low-cost, high-precision ultra-precision component assembly equipment.
The "Nano WorkCell Type10" is an ultra-precision component assembly device that realizes a microfactory, with a footprint the size of A4 and a weight of approximately 30kg. By adopting high-precision motors and high-resolution encoders, it achieves high reliability and precision. It can accommodate the prototyping and production of new micro-optical communication components. We offer high precision of ±100nm at an astonishingly low price. 【Features】 ■ High precision: ±100nm ■ Wide compatibility ■ Excellent low-pressure control: up to 5.00(N) ■ Compact design ■ Low price *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Other Features】 ■ Achieves high reliability and precision through the use of high-precision motors and high-resolution encoders. ■ High-precision image recognition alignment method that ensures high repeatability. ■ Supports prototype development to production of new micro optical communication components. ■ Adoption of specially designed low-wear air actuators. ■ Base Model size: 300mm(W) × 210mm(D) × 450mm(H). ■ Can also accommodate inline applications. *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Our company develops unique technologies in the fields of WLP (Wafer Level Packaging) and WLO (Wafer Level Optics), achieving high precision and high performance that cannot be replicated by other companies. The equipment is semi-customizable, allowing for detailed manufacturing and development that meets customer needs. Our technology maintains high manufacturing capability and reliability by collaborating with major manufacturers in various fields, establishing a robust quality assurance system. We have obtained multiple patents related to each technology and are also developing related technologies and services. Keywords: Nanoimprint, Nano positioning, Wafer level package, MEMS, NEMS.