AJI Company Profile

High speed, high performance, direct casting of lens modules under 1μm, optimal for camera modules, cut tempered glass.

Our company develops unique technologies in the fields of WLP (Wafer Level Packaging) and WLO (Wafer Level Optics), achieving high precision and high performance that cannot be replicated by other companies. The equipment is semi-customizable, allowing for detailed manufacturing and development that meets customer needs. Our technology maintains high manufacturing capability and reliability by collaborating with major manufacturers in various fields, establishing a robust quality assurance system. We have obtained multiple patents related to each technology and are also developing related technologies and services. Keywords: Nanoimprint, Nano positioning, Wafer level package, MEMS, NEMS.