MWC6000
We have started selling the MWC6000, an optimal implementation device for Wafer Level Package (WLP). The MWC6000 enables high-precision implementation on 300mm size wafers, with a stage that achieves flatness of less than 1um using a granite base and air flotation. It also features linear motor drive on both the X and Y axes for high-speed processing. The X-axis is driven by dual motors on both sides. To ensure precision, high-precision glass scales (manufactured by Heidenhain) are installed on all axes, and it is controlled in a full closed-loop system. Additionally, vibrations that can affect precision are canceled using a servo algorithm, reducing them to 1/40 of conventional levels. This eliminates constraints on the installation location of the device, allowing for more flexible layouts. Furthermore, this functionality increases operational speed, reducing the movement time to each position to 150ms, which is half of the conventional time. The positioning accuracy is also 400nm, achieving both high precision and high speed. Applications for this device include high-precision component implementation at the wafer level, manufacturing optical components at the wafer level, and high-precision implementation applications for stages used in inspection, cutting, and MEMS on wafers.
Inquire About This Product
basic information
We have started selling the MWC6000, an optimal implementation device for Wafer Level Package (WLP). The MWC6000 enables high-precision implementation on 300mm size wafers, with a stage that achieves flatness of less than 1um using a granite base and air flotation. Additionally, both the X and Y axes are driven by linear motors, allowing for high-speed processing. The X-axis is driven by dual motors on both sides. To ensure precision, high-precision glass scales (manufactured by Heidenhain) are installed on all axes, and control is achieved through a full closed-loop system. Furthermore, vibrations, which can be problematic for high precision, are canceled using a servo algorithm, reducing them to 1/40 of conventional levels. This eliminates constraints on the installation location of the device, allowing for greater layout flexibility. Additionally, this functionality increases operational speed, reducing the movement time to each position to 150ms, which is half of the conventional time. The positioning accuracy is also 400nm, achieving both high precision and high speed. The applications of this device include high-precision component implementation at the wafer level, manufacturing optical components at the wafer level, and high-precision implementation applications for stages used in inspection, cutting, and MEMS on wafers.
Price information
-
Delivery Time
Applications/Examples of results
We have already received orders from overseas customers, and we plan to sell 30 units of the MWC6000 in the first year. We also plan to strengthen sales in the United States, Taiwan, and Europe.
catalog（1）
Download All Catalogs
Company information
Our company develops unique technologies in the fields of WLP (Wafer Level Packaging) and WLO (Wafer Level Optics), achieving high precision and high performance that cannot be replicated by other companies. The equipment is semi-customizable, allowing for detailed manufacturing and development that meets customer needs. Our technology maintains high manufacturing capability and reliability by collaborating with major manufacturers in various fields, establishing a robust quality assurance system. We have obtained multiple patents related to each technology and are also developing related technologies and services. Keywords: Nanoimprint, Nano positioning, Wafer level package, MEMS, NEMS.