AJI Product Lineup

The "Micro WorkCell1000" is a compact, low-cost, and high-precision ultra-precision component assembly device that realizes micro-factories. By adopting high-precision motors and high-resolution encoders, it achieves high reliability and precision. It features a high-precision image recognition alignment method that ensures high repeatability. It supports the prototyping and production of MEMS semiconductor components that require assembly precision of 100nm, such as SIPs. 【Features】 ■ High precision ■ Wide compatibility ■ Excellent pressure control: up to 5.00(N) ■ Compact design ■ Low price *For more details, please refer to the PDF materials or feel free to contact us.

• Other machine elements

The "Nano WorkCell Type10" is an ultra-precision component assembly device that realizes a microfactory, with a footprint the size of A4 and a weight of approximately 30kg. By adopting high-precision motors and high-resolution encoders, it achieves high reliability and precision. It can accommodate the prototyping and production of new micro-optical communication components. We offer high precision of ±100nm at an astonishingly low price. 【Features】 ■ High precision: ±100nm ■ Wide compatibility ■ Excellent low-pressure control: up to 5.00(N) ■ Compact design ■ Low price *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements

The "Micro WorkCell Series" is a compact, low-cost, high-precision component system that overturns conventional wisdom. By adopting our unique force control unit with a floating mechanism, we achieve low pressure of just a few grams. By combining a wealth of peripheral options, we offer high precision of ±1μm at an astonishingly low price. 【Features】 ■ Achieves ±1μm precision regardless of installation environment ■ High-precision force control ■ High-functionality image processing ■ New image processing software Hexsight adopted *For more details, please refer to the PDF materials or feel free to contact us.

• Other machine elements

We have started selling the MWC6000, an optimal implementation device for Wafer Level Package (WLP). The MWC6000 enables high-precision implementation on 300mm size wafers, with a stage that achieves flatness of less than 1um using a granite base and air flotation. It also features linear motor drive on both the X and Y axes for high-speed processing. The X-axis is driven by dual motors on both sides. To ensure precision, high-precision glass scales (manufactured by Heidenhain) are installed on all axes, and it is controlled in a full closed-loop system. Additionally, vibrations that can affect precision are canceled using a servo algorithm, reducing them to 1/40 of conventional levels. This eliminates constraints on the installation location of the device, allowing for more flexible layouts. Furthermore, this functionality increases operational speed, reducing the movement time to each position to 150ms, which is half of the conventional time. The positioning accuracy is also 400nm, achieving both high precision and high speed. Applications for this device include high-precision component implementation at the wafer level, manufacturing optical components at the wafer level, and high-precision implementation applications for stages used in inspection, cutting, and MEMS on wafers.

• Other machine tools
• Semiconductor inspection/test equipment
• Optical Measuring Instruments