AJI
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AJI Company Overview
High speed, high performance, direct casting of lens modules under 1μm, optimal for camera modules, cut tempered glass.
Our company develops unique technologies in the fields of WLP (Wafer Level Packaging) and WLO (Wafer Level Optics), achieving high precision and high performance that cannot be replicated by other companies. The equipment is semi-customizable, allowing for detailed manufacturing and development that meets customer needs. Our technology maintains high manufacturing capability and reliability by collaborating with major manufacturers in various fields, establishing a robust quality assurance system. We have obtained multiple patents related to each technology and are also developing related technologies and services. Keywords: Nanoimprint, Nano positioning, Wafer level package, MEMS, NEMS.
Business Activities
Sales of WLP-compatible high-precision mounting equipment and research and development mounting equipment. Process development (supporting from product design to mass production, including sample production) achieves high-precision and high-speed mounting equipment optimal for WLP. By handling both the handling and mounting on the same platform, it enables more efficient production. Application fields: Expanding applications for high-precision component mounting at the wafer level and manufacturing optical components at the wafer level, as well as stages for inspection and cutting, and high-precision mounting on wafers for MEMS and other applications. Software (various types available) *Comprehensive support system available overseas (Shanghai, Taiwan).
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Detailed information
| Company name | AJI |
|---|---|
| number of employees | 12 |
| Contact address | postalcode 252-0816 Kanagawa/ Fujisawa-shi/ Endo 2023-9View on map TEL：0466-53-7106 FAX：0466-53-7116 |
| Key Partners | June is the end of the fiscal year. Thank you. Hirata Machinery, Sumitomo Bakelite, Tokyo Seimitsu |
| Industry | Industrial Machinery |
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