Excellent pressure control! Compact design ultra-precision component assembly device.
The "Micro WorkCell1000" is a compact, low-cost, and high-precision ultra-precision component assembly device that realizes micro-factories. By adopting high-precision motors and high-resolution encoders, it achieves high reliability and precision. It features a high-precision image recognition alignment method that ensures high repeatability. It supports the prototyping and production of MEMS semiconductor components that require assembly precision of 100nm, such as SIPs. 【Features】 ■ High precision ■ Wide compatibility ■ Excellent pressure control: up to 5.00(N) ■ Compact design ■ Low price *For more details, please refer to the PDF materials or feel free to contact us.
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【Other Features】 ■ Achieves high reliability and precision through the use of high-precision motors and high-resolution encoders ■ High-precision image recognition alignment method that ensures high repeatability ■ Supports prototype development to production of new micro-optical communication components ■ Adoption of specially designed low-wear air actuators ■ Base Model size: 580mm(W) × 630mm(D) × 660mm(H) (160Kg) ■ Can also be adapted for inline use *For more details, please refer to the PDF document or feel free to contact us.
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Our company develops unique technologies in the fields of WLP (Wafer Level Packaging) and WLO (Wafer Level Optics), achieving high precision and high performance that cannot be replicated by other companies. The equipment is semi-customizable, allowing for detailed manufacturing and development that meets customer needs. Our technology maintains high manufacturing capability and reliability by collaborating with major manufacturers in various fields, establishing a robust quality assurance system. We have obtained multiple patents related to each technology and are also developing related technologies and services. Keywords: Nanoimprint, Nano positioning, Wafer level package, MEMS, NEMS.