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  6. McDermid Silver Sintered Paste Argomax for Automotive and Rail Applications

McDermid Silver Sintered Paste Argomax for Automotive and Rail Applications

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McDermid Performance Solutions Japan Co., Ltd. Argomax

last updated:Sep 26, 2025

セイワ 東京本社、関西支社、名古屋営業所、中国無錫  グループ会社 エレクトロン(長野県松本市)
セイワ 東京本社、関西支社、名古屋営業所、中国無錫  グループ会社 エレクトロン(長野県松本市)
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It enables the manufacturing of power modules with a Tjmax of over 200℃, contributing to improved reliability of chip bonding and overall cost reduction.

The lack of suitable solder materials has previously excluded high melting point lead-free solder from serious consideration, but this is finally changing. At the same time, there is a demand for bonding materials that can maximize the capabilities of next-generation power semiconductors. Alpha Argomax sinter paste is a bonding material that can meet both of these challenging requirements. We are also focusing on the development of high thermal conductivity epoxy paste. The demand for improved reliability and cost-effective high-volume manufacturing (HVM) of die attach has never been higher. With environmentally friendly Argomax technology, it is possible to create low-pressure sintered die attachments based on highly engineered particles. Argomax creates silver bonds with very high thermal and electrical conductivity, providing high reliability and flexible bonding lines. It enables the manufacturing of SiC/GaN power modules/devices with a Tjmax of over 200°C, contributing to improved reliability of chip bonding and reduced total costs. It can also accommodate the lead-free transition for high-reliability bonds. We offer a variety of pastes, films, and preforms tailored to specific applications.

    Solder
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McDermid Silver Sintered Paste Argomax for Automotive and Rail Applications

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  • Seiwa-McDermid Co., Ltd. Introduction Page
  • Special site - Product/service details - https://pr.mono.ipros.com/seiwa-tr/product/

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basic information

- Improved joint reliability: More than 5 to 10 times that of solder joints - Low-pressure sintering process: Improved yield - Shortening of the joining process: Increased productivity - Environmental considerations: Lead-free and improved energy efficiency

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Applications/Examples of results

Inverters for hybrid vehicles, EVs, power transmission, railways, etc.

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McDermid Company Introduction

McDermid Company Introduction

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McDermid High-Performance Materials Product Solution Guide for Semiconductor Packaging and Circuit Board Assembly

McDermid High-Performance Materials Product Solution Guide for Semiconductor Packaging and Circuit Board Assembly

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Company information

セイワ

セイワ 東京本社、関西支社、名古屋営業所、中国無錫  グループ会社 エレクトロン(長野県松本市)

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The development of electronics has given people great dreams and has turned those dreams into reality, one by one. This development has been passed on to the 21st century, inspiring even greater dreams and hopes. I am deeply grateful and delighted to have been able to engage in work that contributes to this segment of the electronics industry. Moving forward, I will continue to serve as a conduit for the appropriate information on semiconductors and electronic components, so that I can help realize humanity's great dreams and support the product and information development of our clients. I am committed to walking alongside our clients and growing together in the information society of the 21st century. However, on the other hand, global environmental issues have become increasingly prominent. As a member of society, I feel the importance of leaving a rich natural environment for the future and preserving the fundamental value of humanity. I am determined to strive towards becoming a company that harmonizes with nature and society as we move towards an endless future.

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