Adopting excellent heat dissipation package technology and analyzing its heat removal circuit!
We provide an analysis report titled "ANALOG DEVICES PSiP (Power Supply in Package) LTM4700 uModule Regulator Structure and Implementation Analysis Report," which selects and analyzes representative products to clarify the packaging technology used in advanced PSiP. This analysis report reveals the technologies used to achieve the performance of the LTM4700 product. [Report Contents] - Structure and package layout of high-current switching MOSFETs - HS/LS half-bridge, source-down configuration of LS FETs - Shielded double poly-Si trench MOSFET structure for high area efficiency - Analysis of a double-sided Cu lead frame package - Identification of controller ICs, etc. *For more details, please download the PDF or feel free to contact us.
Inquire About This Product
basic information
【Table of Contents】 1. Executive Summary 2. Package Appearance 3. Cross-Section Observation 4. Plan View Observation 5. Discussion on Thermal Management and Estimation of Thermal Resistance 6. Appendix *For more details, please download the PDF or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please download the PDF or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Our company is a technology service provider that specializes in delivering technical information (reports) tailored to our customers' needs, utilizing both the semiconductor-based analysis technology we have developed over many years since 1988 and our extensive experience in the investigation and analysis of intellectual property (IP) such as patents.