Can be used for evaluating signal sources such as voltage-controlled oscillators (VCO) and clock generators!
We handle the signal source analyzer/microwave downconverter 'E5052B/E5053A'. Various measurements can be performed in the frequency range of 10MHz to 26.5GHz (spectrum monitoring, frequency and current consumption measurement, phase noise measurement, transient measurement, AM noise measurement, baseband measurement, etc.). 【Features】 - The functions for phase noise measurement and transient measurement have been expanded, allowing for excellent results and enabling complex and time-consuming measurements to be completed in a short time. - AM noise measurement and baseband noise measurement, which were difficult with previous measuring instruments, are now possible. *For more details, please download the PDF or feel free to contact us.
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【Main Specifications (Frequency Range)】 ■ RF Input Frequency Range: 10MHz to 26.5GHz ■ Analysis Offset Frequency Range: 1Hz to 100MHz ■ Capable of phase noise measurement using ultra-low noise and cross-correlation methods ■ Frequency Transient Capture Challenge - Narrow Band: Up to 80MHz - Wide Band: Up to 4.8GHz *For more details, please download the PDF or feel free to contact us.
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For more details, please download the PDF or feel free to contact us.
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The Fukuoka Prefectural Industrial and Scientific Technology Promotion Foundation's Three-Dimensional Semiconductor Research Center has facilities that can design, manufacture, test, evaluate, and analyze embedded substrates with active and passive components wired in three dimensions within printed circuit boards at mass production levels. In addition to a standard printed circuit board manufacturing line, it is equipped with mounting devices for embedding components within the substrate and high-temperature, high-humidity vibration testing equipment to evaluate connection reliability. Furthermore, there is an 8-inch silicon wafer line that allows for the development of test element group (TEG) chips for evaluation. Additionally, it is possible to develop three-dimensional stacking of chips using through silicon vias (TSV) and silicon interposers that use silicon substrates instead of printed circuit boards.
