It is possible to connect to the object being measured with 2.4mm and 3.5mm coaxial connectors!
We offer the network analyzer 'PNA-X N5245A', which can measure the reflection and transmission characteristics of high-frequency signals in the frequency range of 10MHz to 50GHz. It supports measurements with 4 ports and is equipped with a multifunctional single-connection microwave test engine for measuring devices such as amplifiers, mixers, and frequency converters. 【Features】 ■ Calibration can be easily performed using the calibration kit Ecal (2.4mm, 3.5mm) and connection adapters. ■ Equipped with a touch screen, enhancing operability. ■ Can also be operated using a mouse or the main unit's hard keys. *For more details, please download the PDF or feel free to contact us.
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【Main Specifications】 ■Measurement Frequency Range: 10MHz to 50GHz ■System Dynamic Range: 126dB ■Receiver Dynamic Range: 129dB ■Noise Floor: -111dBm (for IF bandwidth of 10MHz) ■Maximum Number of Measurement Points: 32,001 points ■Number of Measurement Channels: Up to 32 channels ■Low Harmonic Signal Source: -60dBc ■High Power Output: +16dBm ■Wide Output Sweep Range: 41dB ■Measurement Ports: 4 ports ■Built-in 2 Signal Sources ■IF Bandwidth: 5MHz ■0.1dB Compression: +15dBm *For more details, please download the PDF or feel free to contact us.
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The Fukuoka Prefectural Industrial and Scientific Technology Promotion Foundation's Three-Dimensional Semiconductor Research Center has facilities that can design, manufacture, test, evaluate, and analyze embedded substrates with active and passive components wired in three dimensions within printed circuit boards at mass production levels. In addition to a standard printed circuit board manufacturing line, it is equipped with mounting devices for embedding components within the substrate and high-temperature, high-humidity vibration testing equipment to evaluate connection reliability. Furthermore, there is an 8-inch silicon wafer line that allows for the development of test element group (TEG) chips for evaluation. Additionally, it is possible to develop three-dimensional stacking of chips using through silicon vias (TSV) and silicon interposers that use silicon substrates instead of printed circuit boards.
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