Introducing electroformed blades with improved abrasive dispersion, enabling a reduction in the pre-cutting process!
The electroformed blade "PB20" is a new blade that achieves stabilization of processing quality through improved abrasive particle dispersion. It also enhances rigidity, suppressing wavering and tilting of the cut line. The "Produce Board" is a special dress board designed to improve the efficiency of the blade setup process during wafer cutting, such as with silicon and compound semiconductors. Please feel free to contact us when you need assistance. *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【PB20 Features】 ■ Improved abrasive dispersion and increased rigidity of the electroplated bond ■ Suppression of waviness and collapse in the cut line ■ Stabilization of calf width by controlling thickness deviation 【Produce Board Features】 ■ High efficiency in blade setup ■ Reduction of pre-cut time and coolant usage *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Since its establishment in 1937, our company has deepened its business as a specialized manufacturer of diamond tools. As an independent corporate group that widely develops its business both domestically and internationally, our greatest strength lies in our ability to invest in various resources such as talent and information based on our own judgment. Additionally, our tools boast high cutting and grinding capabilities and excellent durability, making them suitable for high-speed processing and precision machining. They are utilized in a very wide range of manufacturing fields, including electronics, semiconductors, transportation equipment, machinery, stone, and construction.
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