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  6. grinding disc

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last updated:Jun 15, 2023

ムサシノ電子
ムサシノ電子
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We will introduce a wide variety of grinding wheels, from fixed abrasive wheels to free abrasive wheels and polishing cloths.

When performing precise polishing work, the selection of the polishing disk is crucial. Considering the materials contained in the sample and the desired finish, we will propose the optimal polishing disk.

    Other processing machinesWafer processing/polishing equipmentCMP Equipment
platen_blue_201911.jpg

grinding disc

platen_blue_201911.jpg
platen_blue_201911.jpg
  • Related Link - https://www.musashino-denshi.co.jp/grindingplates/

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basic information

Grinding disk sizes ... Φ150mm, Φ200mm, Φ300mm, Φ381mm 【Coarse Grinding (Lapping) Process】 - Diamond bonded discs (#80 to #4000) - Grinding plates (#80 to #1200) - Grinding discs (P60 to P2000) 【Finishing Grinding Process】 - MF Copper Disc (Compatible Abrasive 2μm~6μm) - HP Ceramic Disc (Compatible Abrasive 0.5µm~3µm) - HP TX Disc (Compatible Abrasive 0.25µm~3µm) - MF Plastic Disc (Compatible Abrasive 0.5µm~1µm) - MF Tin Disc (Compatible Abrasive 0.1µm~1µm) 【Final Finishing Grinding Process】 - 2TS4 (Compatible Abrasive 1µm~6µm) - 2TS5 (Compatible Abrasive 0.5µm~6µm) - 2TS8 (Compatible Abrasive 0.5µm~6µm) - 4FV1 (Compatible Abrasive 0.015µm~3µm) 【CMP Process】 - CMP Cloth (Compatible Abrasive 0.015µm~0.04µm) - CMP Pad IC-1000 (Compatible Abrasive 0.015µm~0.04µm) Additionally, we will introduce grinding discs suitable for your samples, so please feel free to ask.

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Applications/Examples of results

We can perform all types of polishing processes, from coarse grinding to mirror finishing, and from buff polishing to CMP polishing. Please feel free to contact us.

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grinding disc

grinding disc

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Precision Grinding Device "MA-150"

Precision Grinding Device "MA-150"

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Precision Grinding Device "MA-200"

Precision Grinding Device "MA-200"

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Precision Grinding Device "MA-200e"

Precision Grinding Device "MA-200e"

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Precision Grinding Device "MA-300e"

Precision Grinding Device "MA-300e"

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Precision Grinding Device "MA-400e"

Precision Grinding Device "MA-400e"

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Company information

ムサシノ電子

ムサシノ電子

Industrial Machinery

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Our company has been manufacturing polishing equipment, cutting machines, and scribers suitable for precision machining using the technical know-how we have cultivated over many years. We have a significant track record, particularly in cutting-edge technology fields such as semiconductors, ceramics, and optical communications. In addition to standard specification equipment, we also accept the design and manufacture of custom specifications tailored to our customers' needs. To meet the increasing demands for precision in machining and the diversifying needs, we will continue to advance with innovative ideas and technology.

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