Dicing that can cut various materials with high precision!
Fixed pitch cut Material: Silicon wafer Work thickness: 0.7mm Cut width: 0.05mm
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Material: Silicon wafer Work thickness: 0.7mm Cut width: 0.05mm
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We are a company based in Ube City, Yamaguchi Prefecture, with 50 years of history, primarily engaged in various processing of semiconductors and ceramic devices. Through many years of experience in responding to diverse needs, we have cultivated unwavering trust and technical expertise. We will continue to challenge ourselves to create new value through innovative approaches.