Ultra-precision grinding method (HSF) for semi-mirror superhard cutting tools

The cutting edge can be adjusted to R 4μm to 20μm to match the material being cut! This reduces the load on the spindle due to cutting resistance.

This is an introduction to our "quasi-mirror super-hard cutting tools" using our ultra-precision polishing method (HSF). HSF reduces the heat generated by the tool, workpiece, and chips while increasing cutting speed and feed rate. Additionally, we can adjust the cutting edge to R 4μm to 20μm according to the material of the workpiece and your requirements. You can also check comparison images before and after HSF treatment via PDF download. 【Features】 ■ Adjustable cutting edge to R 4μm to 20μm according to the workpiece material ■ Reduction of welding ■ Smooth chip discharge ■ Reproducible and homogeneous tool surface ■ Increased cutting speed and feed rate ■ Reduced load on the spindle due to cutting resistance ■ Reduced heat generation of the tool, workpiece, and chips ■ Improvement of surface roughness Ra 0.1µm to 0.15µm → Ra 0.008µm to 0.015µm ■ Fine irregularities on the cutting edge < 1µm *For more details, please download the PDF or feel free to contact us.

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