We will process SiC and GaN substrates using the CARE method!
"CARE-TEC(R)" is a technology that dramatically improves device performance through ultimate flatness and damage-free processing. We use only environmentally friendly pure water as the processing fluid. Please feel free to contact us if you have any inquiries. 【Features】 ■ Achieves atomic-level flatness ■ Capable of removing processing damage (internal latent defects) ■ Can reduce leakage current *For more details, please download the PDF or contact us.
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【Features of the CARE Method】 ■ High processing efficiency and reduced costs ■ No abrasives used, leaving no scratches or altered layers → 100% yield ■ Atomic-level ultra-flatness *For more details, please download the PDF or contact us.
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Our company is engaged in the processing of SiC and GaN substrates, other substrate processing, semiconductor CMP pad processing, manufacturing of pad processing equipment, and manufacturing of pad inspection equipment. Additionally, we perform polishing of SiC and GaN substrates using the CARE method. Please feel free to contact us if you have any inquiries.