東邦エンジニアリング
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東邦エンジニアリング Company Overview
We contribute to society with innovative eco-technology!
Our company is engaged in the processing of SiC and GaN substrates, other substrate processing, semiconductor CMP pad processing, manufacturing of pad processing equipment, and manufacturing of pad inspection equipment. Additionally, we perform polishing of SiC and GaN substrates using the CARE method. Please feel free to contact us if you have any inquiries.
Business Activities
■SiC and GaN substrate processing, other substrate processing ■Semiconductor CMP pad processing, pad processing equipment manufacturing, pad inspection equipment manufacturing ■Manufacturing of auxiliary plates for pad attachment and detachment, pad regeneration services, substrate CMP processing
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Detailed information
| Company name | 東邦エンジニアリング |
|---|---|
| Contact address | postalcode 512-8062 Mie/ Yokkaichi-shi/ 443, Uwakano Shita, YamabunchoView on map TEL：059-365-4381 FAX：059-365-4383 |
| Industry | Manufacturing and processing contract |
東邦エンジニアリング Building Image 
