A processing technology that maximizes the performance of CMP pads, contributing to the stabilization of polishing performance and reduction of running costs through uniform surface processing!
The CMP pad processing and inspection device "CMP1100S" is a dedicated processing device that performs high-precision surface processing of CMP pads used in the CMP (Chemical Mechanical Polishing) process. In semiconductor manufacturing, the condition of the CMP pad surface significantly affects polishing quality and processing accuracy. This device uniformly processes the CMP pad surface using unique processing technology, maintaining stable polishing performance. Furthermore, by combining it with the pad surface inspection device "INS800SA," it visualizes the surface condition after processing, providing consistent support for quality control. It can be widely utilized from research and development applications to mass production lines.
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basic information
【CMP1100S Features】 ■ Stabilizes polishing performance through uniform surface processing ■ Contributes to extending pad life ■ Reduces running costs ■ High-precision positioning and processing control ■ Supports various processing patterns ■ Streamlines quality control in collaboration with inspection equipment ■ Applicable from research and development to mass production lines 【INS800SA Features】 ■ Allows visual confirmation of pad surface condition after processing ■ Reduces variability in processing quality ■ Supports standardization of quality control ■ Can be utilized for optimizing processing conditions
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Applications/Examples of results
【Applications】 Semiconductor manufacturing CMP process Silicon wafer polishing SiC wafer polishing Power semiconductor manufacturing Research and development CMP pad maintenance CMP pad quality control
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Company information
Our company is engaged in the processing of SiC and GaN substrates, other substrate processing, semiconductor CMP pad processing, manufacturing of pad processing equipment, and manufacturing of pad inspection equipment. Additionally, we perform polishing of SiC and GaN substrates using the CARE method. Please feel free to contact us if you have any inquiries.
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