Ultra-fine processing at the micron level is possible! It is widely applied in fields such as electronic components and semiconductors.
"Electroforming" is a technology that forms metal products with high precision by depositing a nickel plating layer through electroplating. There are three types of cross-sectional shapes to choose from: the "overhang type," where the product is deposited to cover the photoresist; the "straight type," which has a linear thickness direction; and the "laminated type," which consists of multiple layers. It enables ultra-fine processing at the micron level, which is difficult with etching, and is widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field. [Features] - Enables ultra-fine processing at the micron level, which is difficult with etching - Reduces initial costs without the need for molds, allowing for the molding of three-dimensional cross-sectional shapes - Widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field *For more details, please refer to the PDF document or feel free to contact us.
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【Cross-sectional Shape】 ■Overhang Type - Products are deposited to overlap with the photoresist. ■Straight Type - A linear shape in the thickness direction. ■Stacked Type - Composed of multiple layers. *Please contact us if you need a detailed explanation.
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【Proposal Examples】 ■ Metal Screen Printing Plates ■ Precision Particle Separation Filters ■ Metal Masks ■ Metal Crafts *For more details, please refer to the PDF document or feel free to contact us.
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Taiyo TechnoRex Co., Ltd. continues to operate in the fields of prototype development of flexible printed circuit boards (FPC) and printed circuit board testing systems. Since FPC is fundamentally related to the structure of hardware, both high precision quality and shortened development time are required. We have extensive experience and know-how in the manufacturing processes of single-sided FPC, double-sided FPC, multilayer FPC, and their advanced types, and we continuously improve and enhance our technology, resulting in consistent evaluations of our delivery times and quality. Additionally, while technically advancing further miniaturization and high density, we are also undertaking new initiatives such as bump-type and special material electroplating. On the other hand, our printed circuit board testing systems mainly consist of electrical inspection systems and final appearance inspection systems, which are adopted in the mass production sites of FPCs and package/module-type substrates. They operate day and night in quality control settings for substrates used in smartphones, automotive applications, and various electronic devices. We will continue to respond to the increasingly diverse market needs. *On December 21, 2023, the company name was changed from "Taiyo Kogyo Co., Ltd." to "Taiyo TechnoRex Co., Ltd."*