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Electroforming Product List

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Electroforming technology

Electroforming technology

Ultra-fine processing at the micron level is possible! It is widely applied in fields such as electronic components and semiconductors.

"Electroforming" is a technology that forms metal products with high precision by depositing a nickel plating layer through electroplating. There are three types of cross-sectional shapes to choose from: the "overhang type," where the product is deposited to cover the photoresist; the "straight type," which has a linear thickness direction; and the "laminated type," which consists of multiple layers. It enables ultra-fine processing at the micron level, which is difficult with etching, and is widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field. [Features] - Enables ultra-fine processing at the micron level, which is difficult with etching - Reduces initial costs without the need for molds, allowing for the molding of three-dimensional cross-sectional shapes - Widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Electroforming

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Photo etching and electroforming [Processable sizes & accuracy]

Photo etching and electroforming [Processable sizes & accuracy]

We are giving away processing size and accuracy materials! We respond to customer needs with two processing methods: photo etching and electroforming.

We will produce precise thin plate cutting for metal masks, lead frames, encoders, etc., using photo-etching and electroforming processes, employing inexpensive patterns and without the need for molds. We achieve high quality and low prices through photo-etching, which allows for high-precision processing of all metals. 【Fujiseimitsu Industry Technology】 ○ Etching processing using photo masks with high-precision laser drawing equipment ○ Electroforming processing to meet the needs for ultra-high-precision metal masks, etc. ○ UV inkjet printing processing for various materials such as metal emblems and nameplates ○ Precision bending and bar turning processing with high-precision benders ○ Surface treatments such as plating and stainless steel black dyeing For information on processable sizes and precision, please click the button below to download the catalog!

  • Processing Contract
  • Electroforming

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Super High Reliability "Sieve" [Super Micro Sieve] *Original Technology Case

Super High Reliability "Sieve" [Super Micro Sieve] *Original Technology Case

Introducing the innovative technology developed by Semtech Engineering. Adopted in ultra-high-definition innovations for 4K and 8K LCD TVs, computers, smartphones, and more.

Our company contributes to high reliability, top quality, and application-specific design through ultra-fine processing and ultra-high precision sieving using electroforming technology, as well as the development and contract manufacturing of high-pressure special-shaped holes. We have developed the ultra-high reliability 'sieve' super micro sieve and the classification device 'S-150W' that has mastered non-clogging classification technology, and we will continue to pursue innovative technologies in the future. 【Features of Semtech Engineering's Innovative Technology】 - Established fine processing technology with hole diameters of 5μm, pitch of 15μm, thickness of 50μm, and ultra-high aspect ratio (thickness ÷ hole diameter). - Completely removed trace amounts of coarse particles that do not appear in the particle size distribution at the PPB level for hole diameters of 5μm and above mixed during the manufacturing process. - Capable of creating approximately 160 million holes of 5μm in diameter over an area of 20 centimeters in diameter (see image 1). - Remarkable thickness of ≪30–100μm≫ with hardness HV600, which does not break even when dented (see images 2 and 3). - Application example: Special-shaped nozzles for spinning with high precision, high pressure, and an astonishing number of holes (see image 7 for processing example). - Designed hole shapes, hole diameters, and outer diameters according to the intended use, in addition to sieves (see image 4). *For more details, please refer to the PDF document or feel free to contact us.

  • Other mounting machines
  • Electroforming

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