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  6. Reduce reflection points! "Multilayer flexible substrate for high-speed transmission"

Reduce reflection points! "Multilayer flexible substrate for high-speed transmission"

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last updated:May 20, 2026

山下マテリアル
山下マテリアル
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It is suitable for high-frequency applications in the tens of GHz range, and because it allows for high-density RF lines compared to PCBs, it is effective for miniaturizing products.

The "high-speed transmission multilayer flexible substrate" reduces reflection points by integrating FPC and rigid substrates. It is suitable for high-frequency applications in the 10-30GHz range and allows for high-density RF lines compared to rigid substrates, making it effective for miniaturization of products. It also supports wire bonding and can have metal or ceramic reinforcement plates attached for heat dissipation measures. 【Features】 ■ Heat dissipation measures can be implemented by attaching reinforcement plates made of metal or ceramics ■ Miniaturization is possible due to high-density RF lines ■ Compatible with wire bonding *For more details, please refer to the PDF document or feel free to contact us.

    Wiring materials
2021-05-10_10h20_07.png

Reduce reflection points! "Multilayer flexible substrate for high-speed transmission"

2021-05-10_10h20_07.png
2021-05-10_10h20_07.png 2021-05-10_10h20_36.png
  • Related Link - https://www.yamashita-net.co.jp/
  • Special site - Product/service details - https://pr.mono.ipros.com/yamashita-net/product/

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【Specifications】 ■Number of Layers: 3 to 8 layers ■Connection Via: Through Via, Blind Via, Filled Via ■Base Material: Polyimide, Liquid Crystal Polymer ■FPC Thickness: Approximately 200 to 800 μm ■Surface Treatment: Gold Flash, Nickel Palladium Gold, Lead-Free Solder Plating *For more details, please refer to the PDF document or feel free to contact us.

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Multilayer FPC for high-speed transmission

Multilayer FPC for high-speed transmission

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山下マテリアル

山下マテリアル

Electronic Components and Semiconductors

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We are committed to contributing to daily life, society, and industry through value creation driven by materials, technology, and speed (short delivery times) as our motto. FPC can be extremely thin and flexible, allowing it to be used in even the smallest spaces. Therefore, it is utilized in various fields such as smartphones, communication devices, medical equipment, eco-cars like EVs/HVs/FCVs, autonomous driving systems, and VR/AR devices. One of our features is our ability to respond to short delivery times, with the shortest possible delivery being available from the "one-and-a-half-day course." Recently, we developed the "BigElec" FPC, which supports high current. It can be used as a substitute for busbars and harnesses, and we have also obtained a patent for it. We are dedicated to listening sincerely to the needs of our customers and society to develop and create new products, while prioritizing safety and consistently delivering high-quality products. This integrated approach strengthens our foundation for growth and maximizes corporate value. We are building a solid foothold in the ever-changing global market and are striving for continuous growth and development. Please feel free to consult with us.

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