3D Wiring Technology "Three Elm"

Further miniaturization and lightweighting of smart devices! Achieving boardless and harnessless designs is possible.

"Three Elm" is a 3D wiring formation technology provided by our company. By replacing existing substrates and harnesses with Three Elm, we can achieve substrate-less and harness-less designs, enabling space-saving, miniaturization, lightweighting, reduction of assembly work, and expansion of design flexibility. This technology can meet the demands for thinner and lighter electronic devices in mobile terminals, automobiles, medical equipment, and more, in response to the increasing functionality of these devices. 【Features】 ■ Realization of substrate-less and harness-less designs ■ Achieving miniaturization, lightweighting, and space-saving for electronic devices ■ Expansion of design flexibility through increased design freedom ■ Reduction of assembly work *For more details, please refer to the PDF materials or feel free to contact us.

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